Integrated Circuit Packaging Companies and Developments

Date : 29 October 2025

The integrated circuit packaging market is growing rapidly, expected to see a revenue surge into the hundreds of millions from 2025 to 2034. The rising demand for electronic products like smartphones and other small electronics is driving this growth.

Integrated Circuit Packaging Market Key Players

Integrated Circuit Packaging Market Companies

  • Intel
  • Amkor Technology
  • Samsung
  • TSMC
  • Micron Technology
  • NXP
  • HCL Technologies
  • Texas Instruments
  • Spel Semiconductor
  • Infineon Technologies
  • ASM Technologies
  • MosChip Technologies
  • Qualcomm
  • Broadcom

Latest Announcements by Integrated Circuit Packaging Market Leaders

  • In February 2025, Penang Deputy Chief Minister, Yang Berhormat Jagdeep Singh Deo A/L Karpal Singh, expressed, “Backed by over fifty years of industrial excellence, Penang continues to be a premier investment destination for global industrial leaders seeking to expand in Southeast Asia. The establishment of ASE’s new chip packaging and testing facility marks a significant milestone, introducing cutting-edge technological capabilities to its decades-long operations in the state. These further cements Penang’s position as a powerhouse in the global semiconductor landscape, reinforcing its reputation as the ‘Silicon Valley of the East.”

New Advancements in the Integrated Circuit Packaging Market

  • In September 2025, TSMC will launch a semiconductor supply-chain zone at the Pingtung Science Park, joining forces to create an ecosystem for developing equipment, materials, and packaging technologies essential for next-generation semiconductors.
  • In September 2025, Tata Consultancy Services, a leading company in IT services, business solutions, and consulting, announced the launch of its Chiplet-based System Engineering Services, designed to help semiconductor organizations push the boundaries of conventional chip design.
  • In May 2025, IIT Madras unveiled two silicon photonics products that it had developed in collaboration with Izmo Microsystems. This development will enable the integration of izmo’s packaging establishment for photonics chip packaging. The centre also revealed a high-speed silicon photonics QRNG.
  • In June 2025, Siemens Digital Industries Software added two latest tools to its Electronic Design Automation (EDA) portfolio to assist in the design and manufacturing of 2.5D and 3D Integrated Circuits (ICs). The Innovator 3D IC solution enables IC designers to author, manage, simulate, and track heterogeneously integrated 2.5D/3D IC designs.
  • In February 2025, ASE announced the launch of its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan Lepas Free Industrial Zone.
  • In October 2024, KLA Corporation announced the industry's widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing.

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