Organic Substrate Packaging Materials Companies and Developments

The global organic substrate packaging materials market is expected to grow from USD 17.40 billion in 2025 to about USD 28.41 billion by 2034, expanding at a CAGR of 5.60% between 2025 and 2034.

Organic Substrate Packaging Materials Market Top Companies

• Amkor Technology Inc.
• WUS Printed Circuit Co. Ltd.
• ASE Kaohsiung (Advanced Semiconductor Engineering Inc.)
• STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.)
• Compass Technology Co. Ltd.
• Shinko Electric Industries Co. Ltd. (Fujitsu)
• Hitachi Chemical Company Ltd. (Hitachi and Showa Denko)
• NGK Spark Plug Co. Ltd.
• Kyocera Corporation

Latest Announcements by Market Leaders

• In September 2024, Intel senior vice president and general manager of Assembly and Test Development, Babak Sabi, expressed, “after a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come.”

Recent Developments

• In June 2024, TOPPAN Inc. announced the launch of Coreless Organic Interposer for Next-Generation Semiconductors—the World First Supporting Standalone Electrical Inspection.
• In September 2024, Intel announced the launch of next-generation advanced packaging glass substrate technology.

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