The panel level packaging market is expected to grow from USD 0.83 billion in 2025 to USD 15.44 billion by 2034, growing at a CAGR of 38.60% during the forecast period.
Recent Developments by Key Market Players
- March, 2024: The state-of-the-art panel-level packaging foundry Silicon Box declared its plan to work alongside the Italian government to make investments up to $3.6 billion (€3.2 billion) in Northern Italy to build a brand-new, cutting-edge semiconductor assembly and testing facility. By 2028, Silicon Box expects this facility to help satisfy the essential demand for improved packaging capacity to allow next-generation technology. In order to accommodate the most cutting-edge semiconductor packaging technologies available today, Silicon Boxs flagship foundry located in Singapore will be replicated over a period of several years. Additionally, 3D integration and testing will be expanded upon.
- October, 2023: Onto Innovation Inc. the establishment of an Applications Center of Excellence, a tool demonstrator, photo resist qualification, process integration, and research and development (R&D) facility focusing on panel-level packaging (PLP), a major enabler of the rising chiplet market. TechSearch International predicts that the chiplet package market will increase at an annual average pace of 103% during the next three years.
Panel Level Packaging Key Players
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