The semiconductor packaging market is expected to grow from USD 49.89 billion in 2025 to USD 119.96 billion by 2034, with a 10.24% annual growth rate. Asia Pacific led the market with a 54% share in 2024, driven by high demand for consumer electronics and advanced packaging solutions. The market will benefit from innovations like advanced packaging and flip-chip technologies. North America is set to grow significantly, supported by government initiatives like the CHIPS Act, which will boost research and development in semiconductor packaging technologies.
Semiconductor Packaging Market Recent Developments
- In February, 2024, Tata Electronics Pvt Ltd., announced the investment of the US$ 32,28,346.8 in greenfield facility in Assam, India for congregation and testing of semiconductor chips for applications across artificial intelligence (AI), mobile devices, automotive, and other key segments to serve customers worldwide.
- In September 2023, Intel Corporation, technology service providing company, revealed the launch of a glass substrate for next-generation advanced packaging. The glass substrate exhibits properties such as better mechanical and thermal stability and ultra-low flatness, which grows and enhances the interconnect density in a substrate. These characteristics of glass substrate help in the production of high-performance, high-density chip packages suitable for data-intensive workloads.
- In March 2024, Taiwan Semiconductor Manufacturing Company Limited, semiconductor manufacturing company, revealed the plan of developing advanced packaging capacity in Japan, Asia Pacific. The Taiwan Semiconductor Manufacturing Company Limited announced its intent to launch chip on wafer on substrate (CoWoS) packaging technology in Japan, Asia Pacific which comprises stacking chips on top of each other. This semiconductor advanced packaging helps in boosting processing power and reducing power consumption in semiconductor chips.
Semiconductor Packaging Market Key Companies
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