Wafer Level Packaging Manufacturers and Market Growth
The wafer level packaging market size was calculated at USD 9.85 billion in 2024 and is projected to reach around USD 26.12 billion by 2034. The market is expanding at a CAGR of 10.25% between 2024 and 2034. Asia Pacific witnessed the highest revenue share for the year 2023 while Europe is estimated to grow at the fastest rate over the forecast period.
Wafer Level Packaging Market Top Companies
Latest Announcements by Market Leaders
- In September 2024, Mike Plisinski, chief executive officer of Onto Innovation expressed, “With the need for finer, denser interconnects and larger package sizes to support new AI and chiplet architectures, customers and collaborators need to accelerate their technology roadmaps and shorten the time to market. Together, we will develop new panel-level packaging solutions in support of glass core substrates and the rapidly evolving AI landscape.”
Recent Developments
- In September 2024, Onto Innovation Inc., announced the launch of the Packaging Applications Center of Excellence.
- In September 2024, CoreFlow, announced the launch of the new GripJet™ Vacuum Chuck. It is used for Handling Highly Warped Wafers without the need for soft pad elastomers or mechanical flattening mechanism.
- In August 2024, ACM Research, announced the launch of the new Panel Electrochemical Plating (Ultra ECP ap-p) tool. This tool has been designed for fan-out panel-level packaging (FOPLP) and employs a horizontal plating approach.
