The PET sheets for rigid pharma packaging market is projected to expand from USD 2.38 billion in 2025 to USD 5.04 billion by 2035, with a CAGR of 7.8%.
23 January 2026
The mycelium packaging market is projected to expand from USD 90.01 million in 2025 to USD 228.21 million by 2035, with a CAGR of 9.75%.
23 January 2026
The caps for returnable pet bottles market is projected to expand from USD 730 million in 2025 to USD 1049.81 million by 2035, with a CAGR of 3.7%.
22 January 2026
The caps for returnable glass bottles market is projected to expand from USD 450 million in 2025 to USD 790.8 million by 2035, with a CAGR of 5.8%.
22 January 2026
The sports cap closures market is projected to expand from USD 4.9 billion in 2025 to USD 8.78 billion by 2035, with a CAGR of 6.0%.
21 January 2026
The polyolefin shrink sleeve labels market is projected to expand from USD 1.35 billion in 2025 to USD 2.71 billion by 2035, with a CAGR of 7.2%.
21 January 2026
The flexible packaging market top companies are Amcor plc (Switzerland), Mondi (U.K.), Sonoco Products Company (U.S.), Sealed Air (U.S.), Huhtamaki (Finland), Transcontinental Inc (Canada)., Cosmo Films Ltd (India), Polyplex (India), UFlex Limited (India), Jindal Poly Films (India), CLONDALKIN GROUP (Netherlands)
10 December 2025
The top companies in the corrugated packaging market are Mondi Group, WestRock Company, International Paper Company, DS Smith PLC, Smurfit Kappa Group, Nine Dragons Paper (Holdings) Limited, Georgia-Pacific Equity Holdings LLC., Oji Holdings Corporation, Lee & Man Paper Manufacturing Ltd., Packaging Corporation of America.
10 December 2025
Kian Joo Can Factory Berhad, Mold-Tek Packaging Limited (MTPL), Sonoco Products Company, The Sherwin-Williams Company, Axalta Coating Systems, Akzo Nobel NV, HUBER Packaging Group GmbH, Ball Corporation, Smurfit Kappa, and Mondi Plc.
10 December 2025
The top companies in wafer level packaging are Jiangsu Changjiang Electronics Technology Co. Ltd., Lam Research Corporation, Qualcomm Technologies, Inc., ASML Holding N.V., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, Nordson Corporation, ECI Technology, CAPLINQ Corporation, KLA Corporation
10 December 2025
