3d IC and 2.5d IC Packaging Companies and Developments

Date : 07 November 2025

The 3D IC and 2.5D IC packaging market will grow from USD 67.92 billion in 2025 to USD 169.92 billion by 2034, at a CAGR of 10.85% during the forecast period.

New Advancements in 3D IC AND 2.5D IC Packaging Industry

  • In January 2025, The latest offering from Keysight Technologies, Inc. for high-speed digital chiplet design customized for Al and data center applications, Chiplet PHY Designer 2025, has been released. Support for the Open Computer Project Bunch of Wires (BoW) standard and simulation capabilities for the Universal Chiplet Interconnect Express (UCle) 2.0 standard are added by the upgraded program. Chiplet PHY Designer is a sophisticated die-to-die (D2D) design and chiplet design solution that streamlines the tapeout process by enabling pre-silicon level validation.
  • In February 2025, Advanced Semiconductor Engineering, Inc., a global provider of outsourced semiconductor manufacturing services, revealed the expansion of its chip packaging and testing facility in Penang, Malaysia.
  • In September 2024, TSMC, semiconductor manufacturing company, uneviled the introduction of new 3Dblox 2.0 open standard and highlighted achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum took place in Santa Clara, California, U.S.
  • In April 2023, TSMC, semiconductor manufacturing company, revealed and showcased its 3Dblox 1.5, new generation technology developments at its 2023 North America Technology Symposium. To reduce the obstacles to 3D IC design packaging, TSMC company unveiled 3DbloxTM 1.5, the most recent iteration of its open standard design language. With the addition of automated bump synthesis in 3DbloxTM 1.5, designers will be better equipped to handle the intricacies of huge dies with thousands of bumps, potentially cutting down on design timelines by months.
  • In June 2024, Siemens, automation company, uneviled the introduction of the Calibre 3D Thermal software to offer chip and package-inward thermal analysis for 3D integrated circuits (ICs). Siemens engineered its Calibre 3DThermal with aim to address the emerging design and verification restriction that range from early-stage chip exploration to final design signoff.

Key Companies in the 3D IC and 2.5D IC Packaging Market:

Become a valued research partner with us, please feel free to contact us at sales@towardspackaging.com