The electronic packaging market is projected to grow from USD 2.17 billion in 2025 to USD 8.24 billion by 2034, at a CAGR of 16.0%. The report examines material segmentation (plastic, paper, metal, and glass), product segmentation (corrugated boxes, thermoformed trays, blister packs), and end-use industries (consumer electronics, automotive, healthcare, aerospace, and defense). It delivers a regional breakdown Asia Pacific leads due to China and India’s expanding manufacturing base, North America follows with rising e-commerce packaging demand, and Europe benefits from sustainability-led innovation. The report also covers Latin America (LA) and Middle East & Africa (MEA) growth trajectories, competitive benchmarking of companies like Amkor, Intel, and ASE Group, detailed value chain mapping, and global trade flow data for corrugated and plastic packaging exports.
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