The industrial electronics packaging market will grow from USD 2.39 billion in 2025 to USD 3.57 billion by 2034, at a rate of 4.54% per year during the forecast period from 2025 to 2034.
Industrial Electronics Packaging Market Recent Developments by Key Players
- January, 2023: A US patent (D968, 957) was granted to Digi-Key Electronics for a tray product that is utilized to store and transport electronic components. Since the trays are just 25% the size of the sector's standard JEDEC trays, they may be packaged and shipped in fewer quantities with less environmental impact.
- May, 2022: Nefab introduced a line of eco-friendly plastic packaging options, such as cushioning applications and thermoformed trays. Both are composed entirely of recyclable materials and recycled plastics. Additionally, they can be effectively used to circular, return, and one-way flows. Thermoformed solutions from Nefab are offered globally for various sectors such as automotive, electronics, telecommunications, aerospace, and lithium-ion battery.
Industrial Electronics Packaging Market - Key Players
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