The global IoT-enabled packaging market is expected to grow from USD 20.26 billion in 2025 to USD 29.95 billion by 2034, expanding at a CAGR of 4.44% from 2025 to 2034.
Top Players in the IoT-Enabled Packaging Market
Hardware Providers
- Avery Dennison Corporation
- Smartrac Technology GmbH
- Identiv, Inc.
- Thin Film Electronics ASA
- Zebra Technologies Corporation
- Impinj Inc.
- Toppan Inc.
- Stora Enso
- Timestrip UK Ltd.
- NXP Semiconductors
- Other Players
Software Providers
- Kezzler AS
- EVRYTHNG (A Digimarc company)
- Wiliot Ltd.
- SAP SE
- Microsoft Corporation
- IBM Corporation
- Zebra Technologies
- SML Group
- Other Players
Services Providers
Latest Announcements by Industry Leaders
- In June 2025, Thomas Rödding, CEO of Narravero, stated that the Digital Product Passport, which gives businesses, consumers, and authorities easily accessible information about materials, sustainability, repair, and recycling choices, is quickly becoming the standard for smart, sustainable products. A partner ecosystem involving organizations like Identiv and their LoT experience is essential because the PP is a cross-departmental and cross-disciplinary endeavor for businesses. With its NFC and BLE-enabled inlays, tags, and labels, Identiv, a pioneer in smart packaging for PP deployments, gives tangible goods digital identities that facilitate thorough supply chain visibility. (Source: Label Andnarrow Web)
New Advancements in the Market
- In January 2025, the G+D Smart Label, a cutting-edge and creative tracking solution from Giesecke+Devrient (G+D), will have the ability to completely disrupt asset tracking, supply chain management, and logistics by turning almost any item into a fully working IoT device. One of the most portable tracking devices on the market, this innovative technology is incredibly thin just millimeters thick and only marginally bigger than a typical credit card. (Source: Launched)
- In May 2025, the TA Series of Sunfort dry film photoresist is a new product from Asahi Kasei, created to meet the growing demand for sophisticated semiconductor packages used in applications such as artificial intelligence (AI) servers. In the Material segment of Asahi Kasei, this product is positioned as a strategic offering with the goal of enhancing the company's presence in the quickly expanding next-generation chip packaging industry. (Source: Asahi Kasei)
