The semiconductor assembly packaging market is projected to grow from USD 4.93 billion in 2025 to USD 10.24 billion by 2034, at a CAGR of 8.45%. This growth is driven by the rising demand for high-performance and compact electronic devices. As consumers prefer smaller mobile phones and gadgets, the need for advanced packaging technologies is increasing. Growing awareness about protecting electronic components is also boosting market growth. Asia Pacific dominates the market due to strong government support in the region.
Recent Developments
- In September 2025, Prime Minister Narendra Modi inaugurate the SEMICON India 2025 on September at New Delhi. This fourth version is India’s major, with more than 350 exhibiting corporations from 33 countries and regions with a record number of worldwide stakeholders. SEMICON India 2025 is cooperatively prearranged by the India Semiconductor Mission (ISM) under the Ministry of Electronics and Information Technology (MeitY) and SEMI, the global semiconductor industry association.
- In May 2025, Union Minister for Electronics and Information Technology Ashwini Vaishnaw inaugurated India’s first 3-nanometre (3nm) chip design centres located in Bengaluru and Noida, pointing a prime milestone in the country to boost advancement in semiconductor invention.
Top Companies in the Semiconductor Assembly Packaging Equipment Market
- Applied Materials: This company offers a wide range of processing technologies which comprises advanced packaging technologies.
- Lam Research Corporation: It is a prominent wafer fabrication equipment and services supplier for semiconductor industry.
- ASML Holding: It is the worlds single supplier of extreme ultraviolet (EUV) lithography machines.
- ChipMOS TECHNOLOGIES: It is one of the leading Taiwanese semiconductor services companies that focusses in outsourced assembly and testing (OSAT).
- Jiangsu Changjiang Electronics Tech Co: It is an important Chinese provider of semiconductor packaging and test services.
- Others: Plasma-Therm LLC, Onto Innovation, American Semiconductor, ASMPT Ltd, Huatian Technology, King Yuan Electronics Co, Powertech Technology Inc, Siliconware Precision Industries, TERADYNE, INC, Tokyo Electron Limited
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