Through-Silicon Via (TSV) IC Packaging Companies and Developments

Date : 16 September 2025

The through-silicon via (TSV) IC packaging market is growing quickly and is expected to reach hundreds of millions in revenue between 2025 and 2034, supporting the shift toward sustainable transportation. This growth comes from the rising need for high-performance computing, smaller electronics, and devices with more functions. TSV technology makes data transfer faster, lowers power use, and allows higher integration, making it well-suited for advanced uses such as 3D ICs, MEMS, and imaging devices.

Top Through-Silicon Via (TSV) IC Packaging Market Players

Through-Silicon Via (TSV) IC Packaging Market Top Key Players

  • Taiwan Semiconductor Manufacturing Company
  • Intel Corporation
  • Samsung Electronics
  • ASE Group
  • Amkor Technology
  • STMicroelectronics
  • Texas Instruments
  • NXP Semiconductors
  • Micron Technology
  • Broadcom Inc.
  • Qualcomm Inc.
  • Infineon Technologies
  • Xilinx Inc.
  • ON Semiconductor
  • Advanced Semiconductor Engineering (ASE)
  • GlobalFoundries
  • ChipMOS Technologies
  • Rohm Semiconductor
  • Kyocera Corporation
  • Carsem (M) Sdn. Bhd.

Latest Announcements by Industry Leaders

  • In May 2025, Anton Hofmeister, Group Vice President and General Manager, Central R&D for the Analog, Power & Discrete, MEMS & Sensors Group, STMicroelectronics stated that STMicroelectronics is a leading global semiconductor company that serves clients across the range of applications for electronics, in association with the A*STAR Institute of ULVAC and Microelectronics (A*STAR ME) announce the "Lab-in-Fab" expansion (LiF) in Singapore. This new stage involves collaborations with the A*STAR Institute of Singapore. The National University of Materials Research and Engineering (A*STAR IRE) and Singapore (NUS).

New Advancements in the Market

  • In July 2025, STMicroelectronics, a leading worldwide semiconductor manufacturer serving clients throughout the range of electronics uses, is enhancing its worldwide sensor capabilities with the intended purchase of the MEMS sensors division of NXP Semiconductors, centered on industrial sensor applications and automotive safety products. The deal will enhance and broaden ST's cutting-edge MEMS sensor technology and product portfolio, opening up fresh avenues for advancement in the automotive and industrial applications for consumers.
  • In March 2025, TSMC declared its plan to increase its advanced technology investment by an additional USD100 billion in semiconductor production in the US. Enhancing the business's current USD 65 billion investments in its sophisticated semiconductor manufacturing facilities in Phoenix, Arizona, TSMC is anticipated to invest a total of USD 165 billion in the U.S. Three new fabrication plants, two state-of-the-art packaging facilities, and a sizable R&D team center are all part of the expansion, making this project the biggest foreign direct investment ever made in the U.S.