The U.S. AI chip packaging market was valued at around USD 6.8 billion in 2025 and is expected to grow from USD 8.39 billion in 2026 to nearly USD 55.68 billion by 2035, registering a CAGR of 23.40% between 2026 and 2035. This strong growth is driven by the rising demand for generative AI computing, chiplet-based designs, hyperscale data centers, edge AI, and high-bandwidth memory (HBM). The adoption of advanced technologies such as hybrid bonding, 3D chip stacking, and improved thermal management is also creating new opportunities. In addition, government support through the CHIPS Act, increased funding for advanced packaging, growing AI infrastructure, national security priorities, and the expansion of 5G networks are further boosting demand for advanced AI chip packaging in the U.S.
According to my research, the market is evolving rapidly, driven by the expansion of the domestic footprint of major companies. The leading semiconductor manufacturers include Amkor Technology and Intel Foundry helps in expanding local packaging capacity. The major OSAT company in the region is Amkor Technology. The major substrate providers are TTM Technologies and Intel Corporation. The specialized material companies are DuPont, Applied Materials, and Lam Research. The transition to 3D or 2.5D architectures drives the intense competition. Data Center AI holds the dominant position in the market due to the growing compute integration, rise in yield optimization, and the need for extreme compute density. The leading manufacturers are Amkor Technology, Micron Technology, Applied Materials, Intel Corporation, GlobalFoundries, and Cerebras Systems.
| Company Name | Technology Portfolio | AI Ecosystem Relationships | Geographic Presence | Innovation Strength |
| Intel Corporation | EMIB, Foveros, TGV, EMIB-T |
For simulation of chip design, the company uses Google Cloud. The company collaborated with Microsoft for AI capabilities. |
Santa Clara, California Hillsboro, Oregon Rio Rancho, New Mexico Folsom, California Austin, Texas Chandler, Arizona New Albany, Ohio San Jose, California Atlanta, Georgia |
Development of optical integration solutions, Adoption of glass substrate packaging |
| Amkor Technology | S-Connect, Heterogeneous Integration, Flip Chip Packaging, S-SWIFT |
The company partnered with Nvidia to create test technologies and advanced packaging. | Tempe, Arizona, West Chester, Pennsylvania |
Multi-Chiplet Architectures, High-Density Interconnects |
| Company Name | 2.5D Technologies | 3D Technologies | Hybrid Bonding Technology | Thermal Management Capabilities |
| Intel Foundry | EMIB, EMIB-M, EMIB-T, Foveros-S 2.5D, Foveros-R 2.5D, Foveros-B 2.5D |
Foveros Direct 3D, EMIB 3.5D, Intel 3-T |
Foveros Direct 3D | In-Package Liquid Cooling, Low Thermal Gradient Bonding |
| Amkor Technology | CoS, CoW, S-Connect, TSV Integration |
Stacked Die Processes, Advanced Wafer Handling, TSV |
Fine-Pitch Integration, 3D Die Stacking |
Thermal Test Measurement, Thermal Modeling and Simulation |
According to my research, the U.S. chip packaging market is expanding rapidly due to supply chain security, AI demand, and the transition to chiplets. 2.5D packaging is a major contributor to the market due to higher bandwidth, better scaling, shorter signal paths, and chiplet design. The silicon interposer is a key contributor to the market due to the burgeoning heterogeneous integration and the higher demand for thermal matching.
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