Innovative Dow BLUEWAVE™ Technology to Promote Sustainability Image Credits: Sustainable Packaging News Announcement The launch of the advanced BlueWave technology facility at Dows site in Lauterbourg, France, is a new milestone in the France packaging industry. The merged potency of...
Sisley’s Airless Packaging to Raise the Standard of the Cosmetic Packaging Market Image Credits: Sustainable Packaging News Announcement The Sisley, French brand, has confirmed Aptar Beautys irresistible airless packaging for their new face cream for delicate skin. This safe solution...
FPA Unveils Winners of the 2025 Student Flexible Packaging Design Challenge Image Credits: Packaging Strategies The Flexible Packaging Association (FPA) is the foremost advocate and voice for developing the U.S. flexible packaging sector, is delighted to introduce the FPA 2025 Student Flexible P...
TSMC Fast-Tracks Production Schedules by Month TSMC is undeniably one of the important dealers for progressive packaging skills like CoWoS, together with other dealers such as ASE Technology. Though the Taiwan giant is identified to make up for a huge portion of the packing industry, now, the dem...
CRYOVAC® Brand Food Packaging Installs 4,000th Rotary Vacuum Packaging System Image Credits: PR Newswire CRYOVAC® brand food packaging reached a major milestone with the connection of its 4,000th rotary vacuum chamber scheme. The new engine was connected for a long time to CRYOVAC® c...
Sidel Laser Leap: Redefining PET Packaging with Precision, Speed and Sustainability! Sidel, a global leader in packaging solutions, has introduced a groundbreaking laser technology aimed at revolutionizing the food and beverage packaging industry. This innovation marks a significant departure fro...
Samsung Sets Sights on Yokohama with $170 Million R&D Hub Image Credits: Techovedas Samsung Electronics is making waves in the semiconductor industry with plans to open a state-of-the-art chip packaging research and development center in Yokohama, Japan. The company is investing approximatel...
Apple’s Big Bet: The Dawn of the iPhone 17 Era Image Credits: Hindustan Times News The world’s gaze turns once again to Cupertino, California, where Apple is poised to unveil its most ambitious lineup yet. Tomorrow’s launch event at the Steve Jobs Theater promises more than jus...
Expanding AI Mode’s Global Linguistic Horizon In a decisive stride toward democratizing access to advanced search technologies, AI-mode, hailed as the most powerful iteration of AI-driven search, is now being extended to five additional languages: Hindi, Indonesian, Japanese, Korean, and Br...
Sarcina Unveils Advanced UCIe Chiplet Packaging Innovations Image Credits: Bisinfotech Sarcina Technology, which is a leader in semiconductor and photonic packaging design, has declared a series of advanced innovations in chiplet-based interconnect technologies. The corporation has established p...