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Systech Unveils Integrated Packaging Intelligence Suite at PACK EXPO 2025
01 October 2025

Systech Unveils Integrated Packaging Intelligence Suite at PACK EXPO 2025

Systech Launches Integrated Packaging Intelligence Suite at PACK EXPO 2025 The systech is a center of serialization software with integrated hardware solutions for excellent trace and track operations, debuting its end-to-end hardware and software packaging intelligence at PACK EXPO Las Vegas 202...

Signode Showcases New Packaging Innovations at PACK EXPO 2025
30 September 2025

Signode Showcases New Packaging Innovations at PACK EXPO 2025

Signode Brings Complete Packaging Innovations to PACK EXPO 2025 Signode is a well-established global manufacturer of a wide range of transit packaging equipment, aftermarket support solutions, and warehouse automation, showcasing its unified solutions and recent automated packaging innovations at...

Fujifilm Launches Advanced CMP Slurry for Next-Gen Semiconductor Packaging
30 September 2025

Fujifilm Launches Advanced CMP Slurry for Next-Gen Semiconductor Packaging

Fujifilm Introduces High-Performance CMP Slurry for Advanced Packaging Needs FUJIFILM Corporation has announced the launch of CMP slurry for advanced packaging, enabling the integration of multiple semiconductor chips into a single package. Major semiconductor equipment producers have accepted th...

TNT Group Launches Luxury Packaging with Anodized Injected Aluminum
30 September 2025

TNT Group Launches Luxury Packaging with Anodized Injected Aluminum

TNT Group Redefines Luxury Packaging with Anodized Injected Aluminum Image Credits: Premium Beauty News TNT Group is setting its sights beyond zamak. Known for its mastery of this premium, dense, and cool-to-the-touch material, valued for adding weight, durability, and prestige to packaging, the...

LG Chem Introduces Eco-Friendly PID for Advanced Semiconductor Packaging
30 September 2025

LG Chem Introduces Eco-Friendly PID for Advanced Semiconductor Packaging

LG Chem Revealed Sustainable Innovation for Advanced Semiconductor Packaging South Korea-based LG Chems liquid photo-imageable dielectric (PID) is set to enhance semiconductor packaging, with a focus on high-performance and the AI market. This material enhances circuit precision and is overa...

ACD/Labs Launches White Paper Series on AI-Digital-Physical Convergence in Drug Discovery
29 September 2025

ACD/Labs Launches White Paper Series on AI-Digital-Physical Convergence in Drug Discovery

Exploring AI-Digital-Physical Convergence: ACD/Labs Releases New White Paper Series The leading informatics company, ACD/Labs, which advertises and develops software to fuel digitalized R&D, has revealed a new two-part white paper series, titled "AI-Digital-Physical Form." It’s the next g...

24M Technologies Launches ETOP Battery System to Boost EV Range by 50%
29 September 2025

24M Technologies Launches ETOP Battery System to Boost EV Range by 50%

24M Technologies’ new Packaging System to Accelerate EV Range 24M Technologies, a leading battery technology company, has introduced a new packaging system that promises to elevate the EV range by 50% through improved energy density. The 24M ETOP (Electrode-to-pack) system replaces traditio...

Apiject Seeks FDA Approval for Next-Gen Prefilled Single-Dose Injection Device
29 September 2025

Apiject Seeks FDA Approval for Next-Gen Prefilled Single-Dose Injection Device

Apiject Seeks FDA Clearance for Next-Gen Prefilled Single-Dose Injection Device Apiject Systems, Corp. announced that it has submitted a New Drug Application (NDA) to the FDA seeking regulatory approval for the worlds first injectable medicine delivered via Apijects single-dose, single-use prefil...

TekniPlex Healthcare Showcases Innovative Pharma Packaging at CPHI Frankfurt
29 September 2025

TekniPlex Healthcare Showcases Innovative Pharma Packaging at CPHI Frankfurt

TekniPlex Healthcare Highlights Packaging Innovation with Live Demos at CPHI Frankfurt The company is set to represent its Aclar laminates, biodegradable coextruded PP-COC-PP structures featuring a recycling substructure, as well as its high- and extreme-high-moisture and oxygen-resistant PFAS-...

HyVera Brings Hydrogen-on-Demand Technology to the United States
26 September 2025

HyVera Brings Hydrogen-on-Demand Technology to the United States

HyVera’s Hydrogen-on-Demand Technology, Now in the United States Announcement The Hyvera distributed energy declared its entry in the United States with its hydrogen-on-demand (H2oD) technology to the vast American market. This technology is supported by the parent company Envirogroup Hold...