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AMD Radeon RX 9070 GRE Moves Closer to Global Launch with English Retail Packaging
02 June 2026

AMD Radeon RX 9070 GRE Moves Closer to Global Launch with English Retail Packaging

The AMD Radeon RX 9070 GRE has been the only Chinese item since its regional debut the previous year, and for a while, it seemed like it might stay that way. VideoCardz has attained pictures of Sapphire retail packaging for the card with complete English labelling on the Sapphire PULSE version, ...

Le Roy Print Packs Strengthens Packaging Operations with iEcho PK 0705 Digital Cutting System
02 June 2026

Le Roy Print Packs Strengthens Packaging Operations with iEcho PK 0705 Digital Cutting System

In May 2026, Le Roy Print Packs deployed the iEcho digital cutting system, iEcho PK 0705. The cutting machine helps in handling short-run jobs and creating product samples. The deployment of the digital cutting system was done in March 2026. Packnology company supplies a digital cutting system to th...

Konica Minolta and GM Join Forces to Advance Digital Label Production in the United Kingdom
02 June 2026

Konica Minolta and GM Join Forces to Advance Digital Label Production in the United Kingdom

In May 2026, Konika Minolta Business Solutions collaborated with Grafisk Maskinfabrik for the production of end-to-end digital labels across the United Kingdom. The GM company provides its GM DC350 mini finishing system, and the Konica Minolta company offers AccurioLabel technology for the end-to-en...

Waiakea Introduces Algae Based Ink Labels to Advance Sustainable Packaging
02 June 2026

Waiakea Introduces Algae Based Ink Labels to Advance Sustainable Packaging

Waiākea Hawaiian Volcanic Beverages is encompassing its sustainable packaging plan beyond the bottle and on the label, becoming the first company to commercialize beverage tags printed with UV flexographic ink created with carbon-negative and algae-derived pigment. The growth was a natural size. In...

ASE Launches Automated Panel Level Packaging Line for Future AI and HPC Demand
02 June 2026

ASE Launches Automated Panel Level Packaging Line for Future AI and HPC Demand

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a foremost breadwinner of semiconductor meeting and test facilities, proclaimed the growth of an industry-first robotic 310mm × 310mm panel-level packaging manufacturing line, progressing its leade...

Nestle Philippines Launches Sachet Recycling Program with Robinsons Supermarket
01 June 2026

Nestle Philippines Launches Sachet Recycling Program with Robinsons Supermarket

Nestlé Philippines and Restore Solutions have collaborated with Robinsons Supermarket to present reverse vending machines (RVMs) for sachets in four of the store’s locations. “This establishes the value chain of complexity with Nestlé as the producer, Restore as the upcyc...

Baycosmetics Expands Into Supplements With Secured Packaging Supply
01 June 2026

Baycosmetics Expands Into Supplements With Secured Packaging Supply

Japanese cosmetics OEM industry, Baycosmetics, has set up a health as well as food supplements division after securing packaging resources that are facing a shortage in the country. Aluminium bags are extensively utilized for packaging in the food and nutrition sector, comprising dietary supplements...

Brilliant Polymers Showcases Solvent Free Adhesive Technologies for Sustainable Flexible Packaging
01 June 2026

Brilliant Polymers Showcases Solvent Free Adhesive Technologies for Sustainable Flexible Packaging

In May 2026, Brilliant Polymers demonstrated solvent-free laminating adhesive technologies at Interpack 2026. The technology is ideal for high-speed lamination environments and supports solvent-free lamination. The new technology enhances workplace safety and supports diverse flexible packaging appl...

Linx Launches 9000 Series CIJ Printers to Simplify Coding and Improve Production Efficiency
01 June 2026

Linx Launches 9000 Series CIJ Printers to Simplify Coding and Improve Production Efficiency

In May 2026, Linx Printing Technologies introduced the 9000 Series CIJ printer range at Interpack 2026. The new printer range simplifies coding and lowers operator intervention. The new printer is easy to use and maximizes production uptime. The printer range provides long service intervals. Introd...

ASE Launches Automated 310mm Panel Level Packaging for Next Generation AI Chips
01 June 2026

ASE Launches Automated 310mm Panel Level Packaging for Next Generation AI Chips

Advanced Semiconductor Engineering, Inc. (ASE), a partner of ASE Technology Holding Co., Ltd. and a foremost provider of semiconductor assembly and test facilities, announced the development of a manufacturing-first automated 310mm × 310mm panel-level packaging line, advancing its leadership i...