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ALCA Corp Launches First Products with SIG’s Next-Gen Aseptic Pouch System
06 October 2025

ALCA Corp Launches First Products with SIG’s Next-Gen Aseptic Pouch System

ALCA Corp Debuts First Products Using SIG’s Next-Gen Aseptic Pouch System Image Credits: SIG SIG is a worldwide leader in packing systems and resolutions, and ALCA Corp, which is a top contractor of tropical fruit components, is proud to declare the presentation of the first goods filled o...

TSMC Expands Advanced Chip Packaging Plant in Chiayi to Boost AI Growth
06 October 2025

TSMC Expands Advanced Chip Packaging Plant in Chiayi to Boost AI Growth

TSMC Expands Advanced Packaging in Chiayi to Power AI Chip Growth Taiwan Semiconductor Manufacturing Company (TSMC) is the worlds leading contract chipmaker, maintaining a monumental pace in strengthening its supremacy in the artificial intelligence (AI) era through notable growth in its progress...

DeepL Redefines Language AI: From Efficiency to Creativity
06 October 2025

DeepL Redefines Language AI: From Efficiency to Creativity

DeepL Redefines Language AI: From Efficiency to Creativity DeepL is Europe’s most popular and widely approached AI company, serving around 200,000 businesses and having secured 120 million monthly customers to date, with a focus on language AI. Steve Rotter, time and again, has taken the re...

Texas Instruments Launches DLP991UUV Chipset for Maskless Digital Lithography
03 October 2025

Texas Instruments Launches DLP991UUV Chipset for Maskless Digital Lithography

TI Pioneers Maskless Digital Lithography with New DLP991UUV Chipset Image Credits:InsiderPH’s Texas Instruments (TI) announced the launch of DLP991UUV (DMD), a digital micromirror device. The device is a solution for digital lithography, containing 8.9 million pixels, a sub-micron solution...

Baumer Introduces CorrBox Evo to Advance Corrugated Packaging Technology
03 October 2025

Baumer Introduces CorrBox Evo to Advance Corrugated Packaging Technology

Baumer Launches CorrBox Evo, Enhancing Its Packaging Technology Portfolio Baumer has restructured its packaging technology range with its new CorrBox Solution representations, designed for accuracy and regulation in high-volume production of corrugated packaging. The CorrBox solution variety is a...

Borealis Launches Borstar Nextension PE Technology to Boost Recycling in Packaging
03 October 2025

Borealis Launches Borstar Nextension PE Technology to Boost Recycling in Packaging

Borealis Unveils New PE Technology to Advance Design for Recycling Borealis, a leader and provider of innovative solutions, has unveiled its newest Borstar Nextension polyethylene (PE) platform, designed to deliver the highest strength, enhanced processability, and exceptional end-to-end performanc...

RRD Strengthens Food Packaging Services with New SQF and Organic Certifications
03 October 2025

RRD Strengthens Food Packaging Services with New SQF and Organic Certifications

RRD Reinforces Market Position as a Go-To Partner in Food Packaging Image Credits:Label And Narrow Web RRD has expanded its food packaging competencies, bolstered by its newly received Safe Quality Food (SQF) and organic food management certifications, to meet the needs of both brands and regula...

Olympus Partners with DuPont to Launch Eco-Friendly Tyvek Medical Packaging
01 October 2025

Olympus Partners with DuPont to Launch Eco-Friendly Tyvek Medical Packaging

Olympus and DuPont Partner to Roll Out CarbonReduced Tyvek Packaging The Olympus corporation, a leading medtech company dedicated to making individuals lives safer, healthier, and satisfying, has entered a partnership with DuPont de Nemours, Inc. DuPont is a popular face of sustainable innovation...

STMicroelectronics Invests $60M in Tours, France for Advanced PLP Technology
01 October 2025

STMicroelectronics Invests $60M in Tours, France for Advanced PLP Technology

Tours Becomes Hub for ST’s Advanced PLP Technology with $60M Investment STMicroelectronics has revealed new details about the growth of the next generation of Panel-Level Packaging (PLP) technology, having finished a pilot line at its Tours site in France, which is expected to be operationa...

Archroma Expands Innovation with Three New Global Centers of Innovation
01 October 2025

Archroma Expands Innovation with Three New Global Centers of Innovation

Archroma Strengthens Innovation Footprint with Three New Global COIs The new COI highlights Archroma Packaging Technologies promise to offer innovative technologies, closer partnerships with consumers, and industry-leading sustainable innovations globally. The three Global Centers of Innovation, ...