
PrecisioNext’s New Fluxless TCB Technology Marks a Leap in CPO Packaging PrecisioNext has formally declared its new-generation Fluxless TCB apparatus, Loong Advance. This apparatus accepts a formic acid decrease system and provides placement accuracy of up to ±0.5 μm. It will ...

Japan's NEDO Opens Funding Call for Tandem Perovskite Solar Cell R&D Under Green Innovation Fund Japan’s New Energy and Industrial Technology Development Organization (NEDO) has announced a public call for proposals aimed at advancing mass production technologies for next-generation tande...

AI Meets Packaging: Phantm’s New Tool Transforms Data into Insight As Australian brands face growing pressure to reduce waste and adhere to tighter packaging guidelines, access to dependable data is emerging as a major enabler of informed change. Yet, for many industries, apprehending and man...
Luxe Pack Honours Amcor’s CleanStream with Green Award Recognition Image Credits: Amcor Amcor, a well-known leader in producing and implementing effective packaging solutions, received the Luxe Pack in Green Award for its robust CleanStream recycling technology. The technology was ramped a...
RYAM Expands Portfolio with FreezerDurable Folding Carton Board Image Credits: STOCK TITAN Rayonier Advanced Materials (RYAM) has announced the launch of an enhanced freezer application for its portable carton board, specifically designed to meet the packaging needs of the frozen food industry. ...

Europe’s New AI Strategy Targets Reduced Reliance on U.S. and China The European Union (EU) is developing a robust, advanced strategy to operate independently and reduce its reliance on China and the US for technology. Its focus is to alleviate dependency on foreign artificial intelligence (A...

BOE, ECHINT, and Others Drive China’s Progress in TGV Glass Substrate Tech China is enhancing the TGV glass substrate technology with the entry of ECHINT, BOE, and other leaders. The ijiwei quoted CNpowder as a chip packaging technology that has reached an advancement. Alongside the glass sub...
Mondi Helps Özler Tarım Cut Food Waste in Long-Distance Shipments Mondi has collaborated with Türkiye’s Özler Tarım, an exporter of fresh vegetables and fruits, to develop a recyclable corrugated packaging solution jointly. The resolution features a double-wall, corrugated fi...

Advanced Packaging: The New Backbone of AI-Driven Semiconductor Innovation As artificial intelligence continues to push the boundaries of computing, the semiconductor industry is experiencing a significant transformation. The long-standing strategy of shrinking transistors, central to Moores Law is...
Fedemco’s Digital Passport to Advance Wooden Packaging Image Credits: fruitnet Fedemco, a leading Spanish Federation of wooden packaging and its components, has discovered a robust tool to enhance traceability and help companies comply with new EU packaging rules. Its accessible through a ...