HCL Technologies, Moschip Semiconductor Technologies, SPEL Semiconductor, Ruttonsha International Rectifier Ltd, ASE, Amkor Technology, JCET Group, Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd., Fujitsu Semiconductor Ltd., UTAC, ChipMOS TECHNOLOGIES INC., CHIPBOND Technology Corporation, Intel Corporation, Samsung, Unisem (M) Berhad, Camtek, LG Chem, MIC Electronics Ltd., Surana Telecom and Power Ltd., and Vedanta Ltd. are the prominent players operating in the semiconductor packaging market.