The active packaging market reached USD 22.17 billion in 2024 and is projected to grow to USD 45.69 billion by 2034, exhibiting a CAGR of 7.5% during 2025–2034. The report provides in-depth segmentation by type (oxygen scavenger, moisture absorber, shelf-life sensing, and others), application (food & beverage, healthcare, pharmaceuticals, personal care, etc.), and region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa). North America led the market in 2024, while Asia Pacific is forecasted to grow fastest through 2034. The study covers a full value chain analysis, detailed trade statistics, and profiles of major manufacturers including Amcor, Bemis, W.R. Grace, Ampacet, and Ball Corporation, offering competitive benchmarking and supplier mapping.
Global Active Packaging Market Key Players
Latest Announcements by Active Packaging Industry Leaders
- In March 2025, According to Samuel Kessler, senior innovation engineer for active packaging at Prompac, the company moisture protect series is a major advancement in flexible packaging technology. By extending the product range, the company is giving clients choices that strike a compromise between their environmental goals and high-performance moisture protection. With the same moisture adsorption capacity and performance as the MP-1000 series, the MP-2000 series offers a foil alternative. Designed for recycle ready, the MP-3000 series is a mono-polyolefin-based structure that exhibits a notable improvement in product stability when compared to a regular foil-based structure.
New Advancements in Active Packaging Industry
- On 14 April 2025, The Active and Intelligent Packaging Industry Association (AIPIA) revealed the launch of the Interactive Brand Packaging Network (IBPN) which is a new initiative whose goal is to establish packaging as a respected media and consumer engagement channel.
- On 24 January 2025, ProAmpac which is a top company in flexible packaging and material science revealed the launch of ProActive Intelligence Moisture Protect which is a patent-pending improvement and a moisture-absorbing technology that vanishes the urge for desiccant packets.
- In January 2025, In Signapore, Micron Technology, Inc. initiated construction of a new High-Bandwidth Memory (HBM) advanced packaging facility. Tan Boon Khai, CEO of JTC Corporation, PEE Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, attended a ceremony held by Micron to commemorate the event.
- In March 2025, ProAmpac, a material science and flexible packaging company revealed the company is expanding its ProActive Intelligence platform with the introduction of cutting-edge products in the oisture protect line.
- On 14 August 2024, Aptar Food Protection, a part of Aptar has grown the Seawall active packaging solution for seafood which is made in order to assist quality, freshness, and aesthetics which is currently being used by retailers across the United States.
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