The global next-generation packaging market will grow from USD 14.55 billion in 2025 to USD 25.5 billion by 2034, with an annual growth rate of 6.43%. This packaging improves visibility, strengthens security, and makes supply chains more efficient, especially for cold chain shipments. As technology advances, it will further increase the reliability and performance of supply chain logistics. In 2024, North America generated the highest revenue, but Asia Pacific will grow the fastest in the coming years.
Top Companies in the Next-Generation Packaging Market
Industry Leader Announcements
- On 10 December 2024, a TOPPAN Group Company, a completely owned subsidiary of TOPPAN Holdings Inc., revealed its participation in US-JOINT from November 18. It is a U.S.-Japan consortium of next-generation semiconductor packaging established in July this year and spearheaded by Resonac Corporation. , a top manufacturer of semiconductor back-end process materials.
- On 4 September 2024, Onto Innovation disclosed the opening of the company's Packaging Applications Centre of Excellence (PACE), a first-of-its-kind facility in the United States dedicated to panel-level packaging inventions allowing 2.5D and 3D chiplet architectures and AI Packages.
- On 19 May 2025, GlobalFoundries revealed plans to extend its potential in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore's lead public sector research and development (R&D) agency.
Recent Developments
- STMicroelectronics, a worldwide semiconductor leader in delivering to users across the range of electronics applications, disclosed the latest details linking to the growth of the current generations of Panel-level Packaging (PLP) technology with the assistance of a pilot line in its Tours Site, France, which is expected to be operational in Q3 2026.
- In September 2025, Presto Products Company, the Fresh Lock brand, a top company in reclosable flexible packaging technology, will disclose the two latest discoveries, which set the platform for the next generation of slider technology. The FreshLock Ergo Ultra slider has developed the user accessibility with its convenient-grip design, shaped, while the highly anticipated Child-Guard Edge slider system serves child-resistant functionality to small-format pouches, which opens up new opportunities for flexible packaging.
- In August 2025, Nestlé R&D and IBM Research co-developed an AI-powered tool in order to examine novel, high-barrier packaging materials that develop product protection and sustainability. The technology utilises a tailored, trained chemical language model and regression changes to construct materials that align with functionality, safety, cost, and recyclability criteria.
- On 16 January 2025, Amazon started to pack and deliver groceries for customers in Spain using bio-based bags created from vegetable materials produced in Europe, including corn starch and vegetable oil, that can one day be recycled into new bags.
- On 28 May 2025, Asahi Kasei = made the TA Series of Sunfort dry film photoresist as a latest product crafted to align with the rising demand in the field of high-level semiconductor packages utilised in applications such as artificial intelligence (AI) servers.
- On 5 June 2025, BigBasket, a TATA-owned online grocery platform, will have disclosed plant-based billboards across Hyderabad, Delhi, and Bengaluru to communicate its sustainability initiatives. They are officially installed at bus stops, and these green shelters are crafted to mix environmental messaging with public infrastructure, concentrating on the company's rising efforts in lowering carbon emissions and marketing eco-conscious operations.
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