Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a foremost breadwinner of semiconductor meeting and test facilities, proclaimed the growth of an industry-first robotic 310mm × 310mm panel-level packaging manufacturing line, progressing its leadership in next-generation progressive packaging skills. This milestone increases economies of scale by assisting a uniform shift from wafer-level packing to panel-level packaging while protecting planned rule stability across FOCoS and FOCoS-Bridge packaging stages. The new panel line is estimated to start manufacturing in the first half of 2027.
The declaration further emphasizes ASE’s commitment to allow the semiconductor trade to change into the period of heterogeneous incorporation, where presentation is progressively defined by strong bandwidth, low-dormancy intersections across chiplets, high-bandwidth memory (HBM), and ASICs. As AI throttles and high-performance computing (HPC) strategies grow in difficulty, panel-level packaging shows an important innovation to help the roadmap in the direction of trillion-transistor system-in-package planning.
ASE’s programmed panel-level packing line helps 310mm × 310mm format and corresponds with progressive packaging stages comprising FOCoS and FOCoS-Bridge, offering line/space capacities of 2/2µm and 8/8µm, respectively. By shifting from conventional round crackers to rectangular committees, ASE allows notably greater practical area up to 96,100 mm² per panel, permitting for more crashes per unit and increased resource efficiency.
This change to panel-level packing addresses important industry challenges, including growing interposer sizes and rejecting wafer-level efficacy. The larger board format helps enhance throughput and reduce cycle time, while supporting the incorporation of progressively involved multiple die architectures. These advantages are mainly impactful for AI data centres and HPC usages, where demand for bigger package sizes and enhanced I/O density continues to rise.
“ASE is inducing a supporting change in progressive packaging by determining a programmed panel-level production platform that notably increases scalability and efficacy,” expressed Dr C. P. Hung, Vice President of Corporate Research and Development at ASE. “This advance allows higher incorporation density and upholds the progressing needs of HPC and AI systems, where execution, power effectiveness, and manufacturability must be focused holistically.”
16 June 2026
16 June 2026
16 June 2026
16 June 2026