Borealis Unveils New PE Technology to Advance Design for Recycling Borealis, a leader and provider of innovative solutions, has unveiled its newest Borstar Nextension polyethylene (PE) platform, designed to deliver the highest strength, enhanced processability, and exceptional end-to-end performanc...
RRD Reinforces Market Position as a Go-To Partner in Food Packaging Image Credits:Label And Narrow Web RRD has expanded its food packaging competencies, bolstered by its newly received Safe Quality Food (SQF) and organic food management certifications, to meet the needs of both brands and regula...
Olympus and DuPont Partner to Roll Out CarbonReduced Tyvek Packaging The Olympus corporation, a leading medtech company dedicated to making individuals lives safer, healthier, and satisfying, has entered a partnership with DuPont de Nemours, Inc. DuPont is a popular face of sustainable innovation...
Tours Becomes Hub for ST’s Advanced PLP Technology with $60M Investment STMicroelectronics has revealed new details about the growth of the next generation of Panel-Level Packaging (PLP) technology, having finished a pilot line at its Tours site in France, which is expected to be operationa...
Archroma Strengthens Innovation Footprint with Three New Global COIs The new COI highlights Archroma Packaging Technologies promise to offer innovative technologies, closer partnerships with consumers, and industry-leading sustainable innovations globally. The three Global Centers of Innovation, ...
Systech Launches Integrated Packaging Intelligence Suite at PACK EXPO 2025 The systech is a center of serialization software with integrated hardware solutions for excellent trace and track operations, debuting its end-to-end hardware and software packaging intelligence at PACK EXPO Las Vegas 202...
Signode Brings Complete Packaging Innovations to PACK EXPO 2025 Signode is a well-established global manufacturer of a wide range of transit packaging equipment, aftermarket support solutions, and warehouse automation, showcasing its unified solutions and recent automated packaging innovations at...
Fujifilm Introduces High-Performance CMP Slurry for Advanced Packaging Needs FUJIFILM Corporation has announced the launch of CMP slurry for advanced packaging, enabling the integration of multiple semiconductor chips into a single package. Major semiconductor equipment producers have accepted th...
TNT Group Redefines Luxury Packaging with Anodized Injected Aluminum Image Credits: Premium Beauty News TNT Group is setting its sights beyond zamak. Known for its mastery of this premium, dense, and cool-to-the-touch material, valued for adding weight, durability, and prestige to packaging, the...
LG Chem Revealed Sustainable Innovation for Advanced Semiconductor Packaging South Korea-based LG Chems liquid photo-imageable dielectric (PID) is set to enhance semiconductor packaging, with a focus on high-performance and the AI market. This material enhances circuit precision and is overa...