Asahi Kasei Launches Sunfort Dry Film for Advanced Semiconductor Packaging

Asahi Kasei Introduces a New Material for Semiconductor Packaging

Date: 28th May 2025

Announcement

Asahi Kasei has launched a new product in the Tata series, called ‘Sunfort dry film photoresist’. It has been introduced to meet the expectations of advanced semiconductor packaging, primarily for applications such as artificial intelligence (AI) servers. It's an effort to accelerate the material sector within the Asahi Kasei company. The company is upgrading its quality standard by taking the initiative in introducing new solutions in the chip packaging market. The development in the IT and electronics sector has been evolving rapidly, so the demand for packaging software essentials and material components has also been increasing globally. 

Advancement

The new dry film provides a solution with its laser direct imaging (LDI) systems and conventional stepper exposure systems. The transfer of circuit patterns in substrates during the packaging process enhances and improves performance in back-end processes. The ‘Sunfort dry film photoresist’ is an important factor in Asahi Kasei’s electronic business, consisting of electronic components and materials. The industry is termed as a first-priority business to initiate and contribute to the growth factor in a medium-term management plan, ‘Trailblaze Together’.

Study

Interposers are an engaging source to connect substrates and chips, including package substrates. These components are used in advanced semiconductor packages. The components take up a vast amount of space, need well-established technologies, and high multilayer structures to create high-density microwiring. Whereas, dry film photoresist provides a benefit for panel-level processing. This gives a larger surface area in comparison to conventional wafer-level processing. This smoothens the handling and processing of the top-to-bottom sides of the substrates. Asahi Kasei has decades of experience with photosensitive materials and new materials as well. The Tata series provides fine wiring formation in similar applications to panel-level packages.

Progress

Asahi Kasei’s launch of the ‘Sunfort Dry Film Photoresist’ approach will be continued for creating panel-level packaging technology, considering the increase in panel sizes. This supported manufacturers in processing fine wiring, leveraging production efficiency. It minimizes cost and accelerates growth in advanced semiconductor packaging. The Tata series will speed up success as demand for IoT, AI, and the automotive markets increases. The advancement in electronic business was initiated to achieve the medium-term management plan increased by 25% in operational profit between fiscal 2024 and 2027. Due to the rising demand for electronic components, the usage also doubled the profit. The progress depends on the demand for various other markets, which eventually will boost the production of packaging. The company will continue to enhance and improve by developing advanced solutions for advanced markets.