Fujifilm Launches Advanced CMP Slurry for Next-Gen Semiconductor Packaging

Fujifilm Introduces High-Performance CMP Slurry for Advanced Packaging Needs

FUJIFILM Corporation has announced the launch of CMP slurry for advanced packaging, enabling the integration of multiple semiconductor chips into a single package. Major semiconductor equipment producers have accepted this product as a key component for planarizing attachment surfaces in hybrid bonding, a progressive packaging technology primarily aimed at enhancing the presentation of AI semiconductor devices.

CMP slurry is an improving resource utilized in semiconductor production to planarize wafer shells. As semiconductor equipment becomes increasingly compact and multifaceted, the need for even greater wafer flatness has become fully established, making CMP slurry crucial in the engineering process. The essential precision is so high that, if the part of a 300mm wafer were associated to the size of Tokyo’s 23 wards, an urban area top around 627 square kilometers, unevenly corresponding to the size of Chicago, all surface anomalies would requirement to be levelled to within a 1mm margin of fault across the complete area. While CMP slurry is primarily used in the front-end process of semiconductor engineering, its application in progressive packaging procedures, where multiple chips are attached together, has been growing in recent years.

Fujifilm makings CMP slurry at construction sites in Arizona, U.S., Cheonan, South Korea, and Kumamoto, Japan, and strategies to start operations at a new capability in Zwijndrecht, Belgium in spring 2026. By manufacturing near consumers and helping them locally in growth, production, and quality administration, Fujifilm helps a high worldwide market share in CMP slurry. Specifically, Fujifilm holds the world’s leading position in copper interconnect CMP slurry, which is utilized in advanced semiconductor engineering and is anticipated to experience significant growth. Fujifilm’s copper interconnect CMP slurry achieves high polishing efficacy and planarization through exclusive preparation technologies that enhance wafer surface smoothness, corrosion inhibitors that prevent copper oxidation after polishing, and scattering technology that effectively disperses abrasive elements at high concentrations.

The newly launched creation is a development of Fujifilm’s front-end copper interconnect CMP slurry, enhanced for progressive packaging. The preparation of additives, corrosion inhibitors, and abrasives has been superior to attain high-precision planarization of hybrid bonding shells, where copper and oxide films coexist.

Going onward, Fujifilm will increase this product to numerous advanced packaging resources, such as redeployment layers and micro-bumps. Fujifilm will also continue to develop its CMP slurry technology for front-end semiconductor engineering, conducive to further device miniaturization.