Intel, an American multinational technology company, may not lead the chip industry, but it has achieved significant success in advanced packaging. Its Foveros and EMIB solutions are increasingly seen as strong alternatives to TSMC offerings. While high-performance computing remains a key industry focus, the demand for comprehensive compute solutions is growing faster than what Moore Law alone can support.
To stand tall and strong to meet industry demand, manufacturers like NVIDIA and AMD integrated advanced packaging technologies that combined multiple chips into a single package. This boosted density and significantly improved platform performance. Advanced packaging solutions are a key part of TSMC and the supply chain. This segment has been dominated by this for decades, but that could change with an upgrade.
It has been observed that Apple and Qualcomm, in their new job postings, have emphasized their search for talented candidates skilled in Intels EMIB advanced packaging technology. Cupertino is looking to hire a DRAM packaging engineer through their recruitment process, including experienced professionals in advanced packaging technologies such as EMIB, PoP, SoIC, and CoWoS. Qualcomm is also seeking a qualified individual for the Director of Product Management position in its Data Center Business Unit. This role requires a clear connection to Intels EMIB and signaling, along with evidence that the interest aligns well.
The Embedded Multi-Die Interconnect Bridge (EMIB) technology connects chiplets within a single package using a small silicon bridge. This removes the need for a lengthy interposer, unlike TSMC CoWoS. Built on the EMIB architecture, Intel also offers its Foveros Direct 3D packaging technology, which enables stacking the base die with TSVs. The Foveros solution is an excellent option from the company.
Intels interest in advanced packaging solutions is popular because they offer options beyond paper. With its precision, TSMC demonstrates Intel commitment to leading the chip packaging sector. Companies like Broadcom, Apple, and Qualcomm, which compete for custom silicon, are turning to Intel for prominent adoption. NVIDIA CEO, Jensen Huang, offers appreciative and empowering words for Intel Foveros technology, highlighting the excellence of the idea for capitalizing on the heavy demand for advanced packaging.
15 January 2026
15 January 2026
15 January 2026
15 January 2026