Nitto Denko and IBM Join Forces to Advance Semiconductor Packaging Materials

Nitto Denko and IBM Collaborate on Advanced Semiconductor Packaging Materials

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Nitto Denko has entered into a joint growth agreement with IBM to discover progressive packaging technologies and resources for semiconductor applications. In the semiconductor packing field, the growth of progressive packages for AI applications, like chiplets, is gaining momentum. However, demands for higher wiring density for RDL interposer and larger package sizes have elevated new matters such as package warpage and thermal extension. This partnership's goals are to address these challenges by assessing new resources for enhanced thermo-mechanical dependability in semiconductor packaging.

"Nitto is pleased to associate with IBM Research for the progression of resources research to grow next generation RDL technologies," expressed Yosuke Miki, Nitto's Director, Senior Executive Vice President, CTO, General Manager of Corporate Technology Sector. Advances in resources have helped the invention of semiconductor devices and packaging technology. Through this partnership, we hope to develop materials research for progressive packaging technologies to endure to fulfill the demands and challenges of AI."

"We are happy to be working with Nitto to modify resources research for advanced packaging,"

expressed Huiming Bu, Vice President, IBM Semiconductors Global R&D and Albany Operations, IBM Research. IBM has been at the forefront of emerging chiplet and advanced packing technologies for the age of AI. This partnership permits us to combine this proficiency with Nitto’s strong background in resource growth."

In addition to polymeric resources, the arrangement also includes joint research on Nitto’s progressive packaging materials. The two corporations are conducting a wide variety of joint research and development, comprising applications for decreasing thermal extension and warpage of package substrata and technologies to decrease crosstalk noise between fine wiring.