Samsung Electronics to Replace Silicon with Glass Interposers in Chip Packaging by 2028

Samsung Electronics: Innovating Advanced Packaging

The innovation

On 25 May 2025, Samsung Electronics is initiating a major change in the semiconductor industry. The innovation in semiconductors is the replacement of silicon with glass interposers in chip packaging, starting in 2028. This transitional shift is an official announcement. The innovation is an additional factor in the company’s growth. This advancement is based on the technological study, along with an interpretation of the change and impact of the solution in the AI industry.

What developments are impacting the advanced packaging market?

Interposers are a major key component in 2.5D chip packaging in the chip manufacturing company, mainly for AI semiconductors, in which GPUs are covered with HBM or high bandwidth memory. The interposers connect two components for fast and improved communication. The traditional interposers are expensive and effective, on the other hand, witnessing the rising demand of the AI industry. The glass interposers are relatively low-cost and perform better in ultra-fine circuits, and include several other performance booster features.

Technology

The advancement in packaging is possible with the emerging technology. The company is heading towards semiconductor technology just like its other competitors. Samsung's interpretation of this replacing strategy and technology is slightly different. Samsung has developed sub-100*100mm glass units for accelerating prototyping speed to avoid the usage of large glass panels with a size of 510*515mm. This small size might affect efficiency, but it will allow the company to enter the market faster.

Additional innovation

Samsung is focusing on utilizing its PLP line and Cheonan campus panel-level packaging. It considers square panels over round wafers. This will uplift the company and encourage it to secure its first position in the market. The innovation has marked a successful development for the AI industry with its AI-integrated solution strategy. The advancement offers advanced packaging, services, and HBM memory on one platform.

The rising growth of the AI industry opens doors for new opportunities for innovation. Samsung’s transitional shift towards glass substrate for interposers can be a competition in the coming years as technology changes the future of brands and adds new valuable insights to leverage growth in several areas. Samsung’s advance packaging solution will benefit from external orders in the future. This will increase the revenue cycle of the company. The idea will reshape the future of the advanced packaging market.