Three Semiconductor Leaders Drive HBM4 Innovation with New Technologies and Investments

Three Semiconductor Giants to Boost the Development of HBM

Hanmi Semiconductor made an official announcement of its establishment of a team focused on developing HBM4-related equipment. Earlier this year, the company launched TC Bonder 4, which is mainly designed for the production of

BGM4. The chairman of the company, Kwak Dong-Shin, mentioned, “With the relaxed height standards of HBM4, the new TC Bonder 4, featuring significantly improved production efficiency and precision, will support global customers in mass-producing HBM4 in the second half of this year.”

Advancing in the sixth gen, HBM4 offers a 60% speed increase and a power reduction of 60% compared to HGM3E. It supports up to 16-layer stacking and 2,048 TSV, helping to enhance data transmission capabilities.

AMEC

In June, AMEC also mentioned their investor interaction platform that they have deployed in advanced packaging fields, including HBM. The secretary also mentioned that their portfolio already includes CVD, Wafer metrology, PVD, and inspection equipment. The company has also officially launched a silicon etching equipment and CCP etching systems. The company has achieved in-house development, which has made them capable of meeting mass production needs, helping them to become a crucial player.

ACM

ACM Research also announced the application of their private placement of RMB 4.482 billion, which has been approved by the Shanghai Stock Exchange. The previously disclosed proposal also mentioned that the net proceeds will fund three core projects and their testing platform, semiconductor equipment iteration, and working capital replenishment.

ACM Secures Approval for RMB 4.482 Billion Private Placement

ACM Research (Shanghai) announced that its application for a private placement of no more than RMB 4.482 billion had been approved by the Shanghai Stock Exchange. The company also unveiled new technologies that include wet cleaning and electroplated copper (ECP). ACP’s ECP technology has many advantages in filling high aspect ratio TSVs used in advanced packaging. The company is also set to launch advanced electroplating systems like their ECP GIII Platform, mainly innovated for high-performance computing, helping in key requirements for advancing in HBM technology.

The company is also advancing in further upgrading its Ultra C series cleaning tools for 3D structured and advanced nodes, which aim to meet the cleanliness and high-yield demand of HBM.