TSMC Fast-Tracks Advanced Packaging Production to Meet AI Demand

TSMC Fast-Tracks Production Schedules by Month

TSMC is undeniably one of the important dealers for progressive packaging skills like CoWoS, together with other dealers such as ASE Technology. Though the Taiwan giant is identified to make up for a huge portion of the packing industry, now, the demand is so enormous that TSMC cannot keep up with customers demand alone.

Based on explanations by TSMCs Vice GM of Advanced Packaging Technology, it is exposed that the stable has to speed up its packing product roadmap to keep pace with the AI roadmaps from NVIDIA and others. The Taiwan giants entitlements that position packaging manufacture lines in a sequential style isnt conceivable any longer, as consumers have forced the corporate to speed up the process by more than three quarters, and in some cases, even a year.

TSMC is now accepting a plan to future-proof itself, which includes ordering compulsory equipment ahead of schedule. Separately from this, TSMC has combined with local packing suppliers and has even formed an association called "3DIC Advanced Packaging Manufacturing Alliance", which comprises TSMC, ASE, and several companies.

The demand for technologies such as CoWoS, SoIC, and various others is huge due to AI GPU producers like NVIDIA function at a six-month to one-year product pace. This means that for dealers to supply to the demand, they would essential have to formulate production lines way ahead of plan. The pressure on the progressive packaging industry necessitates divergence within the supply chain, and Taiwan is the leading place for all packing facilities. TSMC has strategies to open a capability in the US, but in the short term, it looks like Taiwanese dealers have prepared to cooperate and meet the enormous demand.