Izmo Ltd is a leader in interactive commercialisation and automotive digital solutions, recognised for its robust and scalable technology platforms. The company delivers best-in-class solutions ranging from AI-driven tools and CRM platforms to e-retailing systems, supported by an extensive library of automotive animations and images. Izmo serves major retailers and OEMs across Europe, Asia, and North America, reinforcing its strong global presence and technology leadership.
Apart from providing technologies, the company also offers exclusive digital platforms like AI agents and virtual stores. Furthermore, the company is engaged in discovering new tech, such as silicon photonics. The versatility and dedication in each offering show the internal developmental progress as a responsible company does.
Izmo Ltd. is excitedly informed about its successful efforts in semiconductor packaging, as izmo Microsystems, a specific branch, has established and engineered a crucial 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This solution follows the advanced features of 3D SiP architecture along with the stacked substrates. These substrates are designed in such a way that they precisely meet the rigorous performance base, which is essential for space-grade electronics.
This milestone of izmo is one of the most memorable milestones so far, as the achievement level of this development is commendable and describes the changes in the volume. Learning from the development of the previous, old PCB-related electronics of 200 mm × 200 mm, it is redesigned into a small 81 mm × 81 mm SiP module.
This mitigates the presence of traditional PCB-related electronics by 84%. This compactness mission was accomplished by unifying responsive components in a bare-die pattern onto a stacked-substrate configuration. This was possible using the peak density wire bonding that allowed multi-functional and high routing unification in a compact size.
The new compact module is secured (packed) in full-fledged custom hermetic ceramic packaging. This packaging belongs to the smart brains of India. The enclosure of the packaging is a bit complicated to protect the environment and confirm reliability in the severe vacuum conditions and thermal cycles mainly found in space missions. This breakthrough marks the intensity of the development in the semiconductor packaging market.
The hermetically sealed ceramic packaging and 3D vertical stacking technology will build new confidence in the hearts of smart Indians, as this will mitigate reliance on the prohibited foreign technologies for crucial defense and space applications. This new development has formed a base for the next-gen Quantum Communications and Silicon Photonics, which will ease the journey to a new tech era.
23 January 2026
23 January 2026
23 January 2026
23 January 2026