LG Chem Introduces Eco-Friendly PID for Advanced Semiconductor Packaging

LG Chem Revealed Sustainable Innovation for Advanced Semiconductor Packaging

South Korea-based LG Chems liquid photo-imageable dielectric (PID) is set to enhance semiconductor packaging, with a focus on high-performance and the AI market. This material enhances circuit precision and is overall eco-friendly, as it avoids the use of harmful substances. LG Chem partners with firms worldwide to expand its footprint in a sector dominated by Japanese companies. The PID is a critical insulating medium for robust semiconductor packaging. LG Chem targets the high-performance and AI semiconductor sector.

The tech integration into the innovation to fit into the AI platform has been commendable since the introduction of popular AI technology to every market. LG Chems initiative, with its eco-friendly approach, has the potential to transform the future of the advanced semiconductor packaging market. It paves the way for new advancements and solutions that combine technology with sustainable innovation.

The PID is a photosensitive insulating material used to build accurate circuits that link semiconductor chips and substrates. It provides electrical signal routes, doubling the performance and reliability of semiconductors, and bolsters circuit precision, making it indispensable in the process of advanced packaging. As found, the rising demand for PID, especially in high-performance semiconductors that require fine and dense circuits, is evident. LG Chems liquid PID promises high-resolution patterning, reduced shrinkage and absorption, and balanced curing at low temperatures, which improves process consistency. The material is naturally compliant, with no per- and polyfluoroalkyl substances (PFAS) or other organic solvents, such as toluene and N-Methyl-2-pyrrolidone (NMP).

With its intention to occupy the PID market, highly dominated by Japanese companies, LG Chem is fueling the development of a film-type PID using its deep expertise in film technology, which encompasses electronics materials for automobiles, displays, and semiconductors. Additionally, LG Chem is collaborating with significant global semiconductor companies on this current robust project. Industry experts anticipate a surge in PID demand as semiconductor packaging transitions to a vast substrate, facilitating easier interconnections to meet the requirements of high-performance and AI computing.

The company highlighted its film PID capability, which enables sustained continuity in thickness and patterns on large substrates due to its adhesive in-built nature. With its highest elasticity, reduced moisture absorption, and strength, it mitigates the risk of cracking despite temperature fluctuations and can be implemented without modifying the existing process. This enables substrate manufacturers to accelerate the development of their latest equipment.