Longsys has revealed its first combined-packing mSSD (Micro SSD), advanced below its "Office is Factory" model. By redefining how SSDs are packed and formed, this innovation offers excellent quality, high efficacy, and low costs in a compact design, allowing flexible and sustainable engineering. The mSSD includes the manager, PMIC, and NAND Flash within a single SiP set.
This pattern eliminates around 1,000 solder joints in outdated PCBA SSDs, preventing issues such as solder pollution, component intrusion, and reliability degradation caused by heat or moisture. The consequence is chip-level superiority, with DPPM condensed from ≤1000 to ≤100, a tenfold enhancement. By integrating engineering into a single step packing procedure, the mSSD eliminates PCB escalation, reflow soldering, and multiple transmission stages. This doubles transport efficacy and reduces additional charge by 10%, while significantly cutting energy consumption and carbon emissions in line with global sustainability goals.
With its ultra-compressed size (20 × 30 × 2.0 mm, 2.2g), the mSSD fulfills PCIe Gen4×4 specifications, achieving 7400 MB/s for consecutive reads and 6500 MB/s for writes. Its progressive thermal pattern, utilizing superior-conductivity aluminum alloy, graphene, and excellent-conductivity silicone, ensures a stable, complete-speed process, making it ideal for AI PCs, drones, gaming handhelds, and VR strategies. Power efficacy also fulfills the NVMe L1.2 low-power standard (≤3.5 mW).
For superior flexibility, the mSSD supports TLC/QLC NAND and comes in dimensions from 512GB to 4 TB. A clip-on thermal development card permits tool-free adaptation between M.2 2230, 2242, and 2280 form factors. Operators can even execute on-site customization through UV or inkjet printing, rotating the "Office is Factory" notion into reality.
With its unified SiP pattern and agile engineering model, the Longsys mSSD enables both consumer and industrial brand customers to achieve faster customization, reliable quality, and efficient delivery. Longyis continues to influence innovation in global storage technology, delivering smarter, greener, and more flexible storage solutions to the world.
It is a worldwide leading branded semiconductor recollection initiative, involving R&D, design, packaging and testing, engineering, and sales facilities. Longsys supports the business idea of "Everything for memory." With remembrance technology invention at its core, Longsys offers high-end, flexible, and effective full-stack modified facilities to worldwide consumers.
26 January 2026
26 January 2026
23 January 2026
23 January 2026