Resonac Launches JOINT3 Consortium with 27 Global Companies to Advance Semiconductor Packaging

Resonac Launches 27-Member "JOINT3" Consortium

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Resonac Corporation announced the formation of "JOINT3," a co-creation assessment agenda shaped by an association including Resonac and 26 other corporations from the United States, Japan, Singapore, etc. These corporations, all important worldwide leaders in the semiconductor distribution chain, will cooperatively advance resources, equipment, and project tools enhanced for panel-level organic interposers semiconductor packing technology that uses organic resources to generate a bridge between different machineries on a circuit board by utilizing a prototype manufacture line for the production of 515 x 510mm panel-level organic interposers.

Resonac will create an "Advanced Panel Level Interposer Center (APLIC)" as the chief hub for this inventiveness within its Shimodate Plant (Minami-yuki) in Yuki City, in Japan’s Ibaraki Prefecture. APLIC will line the prototype manufacture process, which is arranged to begin processes in 2026. Here, the Consortium will hasten development efforts by bringing verification consequences that thoroughly mirror real-world assemblies.

In recent years, packaging for back-end procedures has appeared as a main technology in the arena of next-generation semiconductors. This comprises 2. xD packages, whereby numerous semiconductor chips are set in parallel and linked via interposers, demand for which is anticipated to develop in line with the requirement for amplified data communication volume and speed. As semiconductor presentation progresses, interposers are getting larger, and there is a change from silicon interposers to organic interposers generated from organic resources.

Predictable manufacturing processes include cutting rectangular fragments from circular wafers. Though as interposers upsurge in size, the number of them that can be attained from a single-wafer reduction pretense a noteworthy challenge. To address this matter, an engineering procedure that changeovers fromchanges over from circular wafer figures to square panel figures is gaining consideration, as it permits a number of interposers to be formed from a given section of wafer.

As a groundbreaker of the JOINT3 consortium, Resonac will offer R&D priorities, manage the process of the prototype manufacturing line, and influence the overall development of the inventiveness. Through co-creation with participating corporations, Resonac will also endorse the growth of resources enhanced for panel-level organic interposers.

Hidehito Takahashi, President and CEO of Resonac Holdings Corporation, stated,

"JOINT3 brings together world-class companies from a variety of fields. Combining the complementary strengths and expertise of each company allows us to collectively address challenges in areas that were previously unreachable. This endeavor goes beyond mere technological development and will lead to solutions that address societal challenges. We are excited by the potential that this initiative offers."