SK Hynix is developing a new packaging technology that aims to boost the performance and stability of HBM4. This technology involves increasing the thickness of some DRAM dies and reducing the gap between them to improve power efficiency.
The new packaging technology helps to break through these technical limitations, and it has two main objectives. First, to increase the thickness of some upper-layer DRAM dies compared to before, enhancing the chip's mechanical stability. Second, narrowing the gap between DRAM dies even further, improving power efficiency while maintaining the overall packaging thickness.
Kangwook Lee, Vice President, presented the company’s cutting-edge advancement in High Bandwidth Memory and packaging technology, positioning the leader in custom memory solutions for the AI era. He presented heterogeneous integration technology, which combines different semiconductor processes into a single package.
Collaboration of TSMC & SK Hynix is leveraging TSMC’s 5-nanometer process to enhance the base die of HBM4. This partnership aims to boost performance and energy efficiency in the rapidly expanding AI market.
The company also offers CMR-MUF packaging technology, which has advantages in heat dissipation and is set to be used in HBM4’s production.
As AI continues to grow in the market, SK Hynix is positioning itself to meet the demand with its next-generation solutions. Samsung Electronics and SK Hynix are over the core infrastructure of the AI era. Both companies are putting all their efforts into technology development and securing supply chains to hold leadership in HBM4.
According to a report by TrendForce citing ZDNet, SK Hynix is advancing a packaging architecture improvement plan. With current improvements, core measures include increasing the thickness of DRAM chips and reducing the spacing between DRAM layers.
This new technology is commercialized and can enhance HBM performance without requiring capital expenditure, but for mass production, it still presents unresolved challenges in terms of technical stability and process consistency.
As of now, SK Hynix is actively advancing relevant verification efforts, but the commercialization timeline remains unclear.
12 March 2026
12 March 2026
12 March 2026
12 March 2026
