Socionext Expands Partnership with Imec to Advance Chiplet and 3D Packaging Technologies

Socionext and Imec Strengthen R&D Collaboration in Chiplet and Advanced Logic Technologies

Socionext has transformed its supportive research arrangement for the Core Partner Program with imec, the sovereign research institute and invention centre. Through its contribution in the Core Partner Program, Socionext has shown and endorsed research actions across Design-Technology Co-Optimisation and System-Technology Co-Optimisation, for both power logic semiconductor and 2.5D/3D packaging.

Under this transformed agreement, Socionext expressed that it will look to enlarge its actions in 3D advanced packing technologies to progress chiplet dependability and to further strengthen its research events in chiplet demonstration design, for applications that include automotive.

According to Socionext, these new technologies will offer high-precision, high-quality, leading-edge semiconductor products.

The progress of computing power has influenced noteworthy advances across multiple businesses and is now capable of processing enormous amounts of data immediately. However, that has come at a cost in that the semiconductor technology, at its essential, has also become far more intricate.

Chiplets and 3D heterogeneous incorporation are observed as offering a more flexible resolution to address amplified workload and application needs, to develop technologies to Angstrom nodes, as well as allow advanced logic semiconductor technologies to help high-density mounting comprising backside wiring technologies that are observed as important and have progressively become the emphasis of R&D efforts worldwide.

The design and expansion of devices utilising these unconventional technologies will be essential to address thermal and mechanical strength matters, but along with the expansion of highly effective designs, there is also the requirement to significantly decrease skyrocketing growth and engineering costs.

When it comes to automotive chiplets, contemplation must be applied to the physical mechanism as well as to develop a deeper empathetic for the engineering technology in order to confirm high dependability.

Therefore, through this improved partnership with imec, Socionext will be able to extend its access to front-line technologies and support its capability to grow products that fulfil the requirements of its customers in key focus areas, comprising progressive SoCs for automotive applications.

Hisato Yoshida, President and COO of Socionext, expressed,

“Since its establishment in 2015, Socionext has continuously participated in the imec Core Partner Program and accumulated a wealth of knowledge. By further promoting the collaboration with imec, we aim to contribute to global innovation while also focusing on nurturing engineers equipped with the world’s most advanced technological capabilities.”