D-Wave Launches Cryogenic Packaging to Advance Quantum Computer Scaling

D-Wave Quantum introduces Cryogenic Packaging initiative

Image Credits: D-Wave

D-Wave Quantum, a leading computing systems, software and services leader, has introduced a new initiative to advance cryogenic packaging for scaling the development of its gate model and annealing quantum processor. It is expected to help the company improve and expand its footprint in multichip packaging capabilities and equipment. The company aims to boost their cross-platform technology at the same time by expanding its supply chain fundamentals.

The company is expected to leverage expertise at NASA Jet Propulsion Laboratory, which is an R&D facility managed by Caltech. They have introduced the end-to-end superconducting of chips, which is expected to serve as a crucial foundation in annealing and gate model architecture. All the expertise is harnessed by the JPL’s superconducting interconnection of chips.

D-Wave Quantum stated their positive beliefs on the use of superconducting bump bonds that will help in building advanced and bigger quantum computers. The bonds are a crucial part for managing a new type of fluxonium and also for connecting multiple chips in a single system. The company is adopting new tools to support the initiative, which will help in supporting analogue-digital quantum computing technologies.

The CDO of D-Wave, Dr Trevor Lanting, said that

“Scaling both annealing and gate-model quantum computers requires high-performance packaging. We believe this strategic initiative will allow us to further extend our leadership position in quantum systems technology development and support our exciting and aggressive product roadmap on the path to 100,000 qubits.”

The working of a quantum processor is a bit challenging, as it requires special packaging that can perform in low temperatures and avoid magnetic fields, allowing the electricity to flow without any resistance throughout the system.