PrecisioNext Unveils Fluxless TCB Technology for Future CPO Packaging

PrecisioNext’s New Fluxless TCB Technology Marks a Leap in CPO Packaging

PrecisioNext has formally declared its new-generation Fluxless TCB apparatus, Loong Advance. This apparatus accepts a formic acid decrease system and provides placement accuracy of up to ±0.5 μm. It will be extensively applied in future progressive packaging procedures such as 3D, CPO, 2.5D, and Cu-Cu bonding. As a groundbreaking optoelectronic integration technology, CPO mixes usually disconnected optical mechanisms, comprising photonic integrated circuits (PICs) and electronic integrated circuits (EICs), onto the same packaging substrate or interposer to form an optical engine (OE), which is positioned around the ASIC chip on the substrate. Compared to outdated pluggable optical modules, CPO decreases power consumption by 50%, lowers latency to within one nanosecond, enhances signal integrity by 18dB (63 times), supports ultra-high bandwidth of more than 1.6T, and provides higher integration density. These compensations are influencing transformative waves in high-speed data centers, AI computing groups, and communication systems.

According to commanding predictions, the worldwide CPO industry is anticipated to grow from $46 million in 2024 to $8.1 billion by 2030, with a compound annual growth rate (CAGR) of 137%. In the current early expansion stage, CPO identifies bottlenecks such as thermal supervision (3D stacking temperature >85°C), packaging yield (<85%), and high costs. CPO modules charge thousands of dollars, with packing engineering accounting for 30% to 50% or more of the total charge. Scaling manufacturing is essential to decrease prices, and this quantity is expected to decrease significantly as technology develops and mass production is achieved.

In CPO packing engineering, the incorporation of EIC and PIC is one of the most serious steps. NVIDIA’s Spectrum-X Photonics CPO switch utilizes TSMC’s COUPE technology (a 3D packing technology based on hybrid attachment). Intel’s Optical Compute Interconnect (OCI) CPO utilizes a silicon interposer and thermocompression bonding (TCB) for optoelectronic integration. Broadcom’s BCM78909 CPO, industrial by TSMC, also uses TCB (a 2.5D packaging technology based on a silicon interposer). TCB is presently the most developed and cost-effective solution for CPO packing. Fluxless TCB eliminates the risk of flux pollution that outdated TCB may cause to optical chips, making it a core component for future CPO mass production.