FUJIFILM Corporation has recently launched ZEMATES, a new brand to join FUJIFILM’s robust portfolio. It’s a new line of photosensitive insulating materials that will enhance and support semiconductor back-end processes focused on polyimide. This strategy underlines the company’s dedication to the creative initiative in the semiconductor industry and promotes semiconductor packaging accordingly.
FUJIFILM states that this new brand mirrors its mission to remain a loyal, trusted partner, a huge push to the next generation of the semiconductor market, and to discover innovation alongside customers by offering reliable and effective materials. The ZEMATES-queued work to date involves protective films, polybenzoxazole (PBO), and film-type polyimide for RDL and redistribution layers (RDL) to ensure film integrity.
FUJIFILM noted that these products are used as insulating layers during certain stages of semiconductor packaging, supporting the applications of power semiconductors and enhancing the quality and performance of AI chips. It is well recognized for its insulation properties and heat resistance, as the materials have gained reliability and recognition. With a strong supply network in the U.S., Europe, and Japan, the company's expansion and worldwide sales will accelerate as inquiries from new customers continue to flow in.
This new brand launches leveraging supportive materials and has rapidly gained traction due to rising demand for modern semiconductor packaging, driven by the need for lower-volume consumption in AI and peak performance across robust chips. Observing the trend within the peak volume, the industry for photosensitive insulating materials used as interlayer dielectrics in RDLs is important for planarization, wiring miniaturization, low dielectric constant, and low thermal expansion. The market is expected to grow at a 15% annual rate.
FUJIFILM intends to focus on extending sales of the liquid-type polyimide as the leading product. Further, it focuses on the early market launch of film-type polyimide, enabled by its accurate coating technology. FUJIFILM is focusing on expanding sales of photosensitive insulation materials, aiming to double, triple, and exceed FY2024 levels by FY2030.
This new product complements and aligns best with the panel-level packaging (PLP) processes. This level of compatibility and support is important for large substrates and fine wiring in ready-to-execute substrates. Each ZEMATES polyimide product is free of PFAS and other per- and polyfluoroalkyl substances, with environmental purity in mind.
26 January 2026
26 January 2026
23 January 2026
23 January 2026