Global Unichip Corp. (GUC) and Ayar Labs have entered a partnership to unify co-packaged optics (CPO) into GUC’s enhanced ASIC design services. This partnership will pave the way for low-latency, power-efficient optical interconnects and high bandwidth in future HPC, networking, and AI applications. By unifying Ayar Lab’s TeraPHY optical engines into the robust GUC ASIC workflow and advanced packaging, the companies are creating the crucial space for future CPO deployment. This new partnership is paving the way for advances in chip packaging.
The CTO of GUC, Igor Elkanovich, said, “The CPO era is near the corner. Unifying Ayar Lab’s optical engines into our robust advanced packaging flows is a crucial step. Our new combined design enables us to identify the barriers to CPO integration across power, signal integrity, thermal, mechanical, and architectural domains. This will assure access to a high-bandwidth, power-packed, and robust solution to future customers.”
The new XPU multi-chip package (MCP) design will replace the old electrical design, with Ayar Labs’ optical engines connected directly to the MCP organic substrate. This architecture stimulation from the XPU package enables an above-100Tbps full-duplex optical interface, doubling the magnitude enhancement over recent XPUs. The design identifies the power integrity and signal barriers linked with the large-scale package.
The thermal refining is processed at the XPU MCP level, and the newest stiffener design meets optical engines’ needs while allowing detachable fiber connections without warpage or mechanical stress.
With this collaboration, the GUC will share detailed insights into these technological advancements at the TSMC Open Innovation Platform (OIP), Ecosystem Forum in Hsinchu, Taiwan, on 18th November 2025. The presentation title is ‘Advanced Packaging Technologies for Modular and Powerful Compute’. The excellence of tech-packing is a revolutionary trend and positive change in the vast packaging market. Apart from the presentation, the partnership between the GUC and Ayar Labs will discover new solutions to the chip packaging sector.
The CTO and co-founder of Ayar Labs, Vladimir Stojanovic, said, “The future of data center and AI scale-up is nothing without optics to win the electrical I/O game-changing bottleneck. Working with GUC on the silicon technologies and advanced packaging is a crucial step in elaborating on how our optical engines can leverage the execution of co-packaged optics for AI boost and hyperscalers.”
26 January 2026
26 January 2026
23 January 2026
23 January 2026