Indium Corporation Launches WS-910 Water-Soluble Flip-Chip Flux for Advanced Semiconductors

Indium Corporation has introduced WS-910, a high-performance water-soluble flip-chip flux designed for next-generation semiconductor packaging. It offers superior tackiness, easy cleaning, and full compatibility with lead-free alloys.

Author: Vidyesh Swar Published Date: 11 August 2025
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Indium Corporation Presents WS-910 Water-Soluble Flip-Chip Flux

Indium Corporation Launches WS-910 Water-Soluble Flip-Chip Flux for Advanced Semiconductors

Image Credits: Indium Corporation

Indium Corporation is a worldwide identity of the refiner, smelter, producers, and dealers of progressive materials, has formally declared the global release of WS-910 Flip-Chip Flux, which is a water-soluble dropping flux exactly engineered to address the presentation demands of next-generation semiconductor strategies.

WS-910 Flip-Chip Flux offers industry-leading deposit removal performance for a water-soluble fluidity, making it extremely companionable with molded and vessel underfill materials utilized in advanced semiconductor packing. The preparation also features excellent tackiness, mainly beneficial for locking large die mechanisms during the reflow procedure. With the presentation of WS-910, Indium Corporation additionally extends its already inclusive portfolio of semiconductor meeting resources custom-made for high-dependability and advanced packing applications.

The Halogen-free WS-910 Flip-Chip Flux delivers a Wide Variety of Performance Advantages, Including:

  • Superior tackiness to support and prevent non-wet open flaws and eradicate “cold joints”
  • Maintaining solderability across a wide range of substratum exteriors
  • Stable dropping presentation over time to confirm steady engineering harvests
  • Easy and detailed deposit cleaning, consuming pure room-temperature deionized water
  • Complete compatibility with lead-free solder structures and all high-tin alloys
  • Established compatibility with average ultrafiltration and adapted ultrafiltration cleaning structures

Designed with diminishment trials in mind, Indium Corporation’s flip-chip fluidity solutions comprising WS-910 efficiently address problems such as substratum warpage, ultra-fine terrain, and high I/O count gatherings. The company provides both water-soluble and ultra-low deposit no-clean flux variations, giving producers a sustainable and low-deposit alternative to outdated cleaning-intensive procedures.

Qu is engaged in the marketing sector, sales working out, and a cross-functional organization. The aim is to help worldwide teams through direct meetings and strong product supervision, with an emphasis on deepening consumer relationships and rationalization partnerships across areas. By consolidation the feedback loop between field squads and R&D, its aim is to help accelerate the commercialization of new resources.

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