Nordson Electronics Unveils New Panel-Level Packaging Solution for Semiconductor Industry

Nordson Electronics Solutions Introduces Panel-Level Packaging Solutions

Image Credits: Nordson Electronics

Nordson Electronics Solutions, which is a worldwide leader in consistent electronics engineering machinery, has established numerous solutions for panel-level packaging (PLP) at the time semiconductor manufacturing. In one specific condition, Nordson’s customer, Powertech Technology, Inc. (PTI), saw that underfill produces progress increased to greater than 99% as they designed to change from wafers to sheets in their engineering processes.

For facts about this resolution, established in late 2024 and 2025. PTI, which is one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) corporations, functioned with the Nordson usage team to set up connections to a complete PLP demo that attained enhanced-quality, void-free underfill consequences at scale, utilizing the industry-leading ASYMTEK Vantage Series fluid supply arrangement, fortified with the ASYMTEK Intellijet Jetting system. Nordson’s accuracy technology lessened warpage and enhanced fluid flow while reducing cycle time by approximately 30%.

PLP provides a path to handling the difficulty of bigger die sizes and advanced-density plans while preserving manufacturability and cost competence as the semiconductor manufacturing changes from 300-mm wafers to sheets. PTI is allowing PLP usages that are planned to fulfill the semiconductor trade’s rising demands to attend AI, high-performance computing (HPC), and chiplet-based constructions. Underfill has been essential in semiconductor packing since the acceptance of flip-chips in the 1990s. As submissions have become more challenging, mainly in high-performance CPUs, GPUs, and unconventional constructions like flip-chip and 2.5D/3D ICs, the status of underfilling to improve mechanical dependability and thermal presentation has become fully-fledged.

Since the opening, Nordson has established inventions for underfill procedures as the business progressed from PC board, substrate, wafer, and new panel usages. Nordson Corporation is an advanced precision expertise corporation that influences a scalable development framework through a commercial, division-controlled organization to carry top-tier development with significant margins and revenues. The Company’s sales model and usage proficiency serve worldwide consumers through an extensive diversity of perilous applications. Its varied end-market experience comprises customer non-durable, medical, industrial, and electronics end markets. It was established in 1954 and its headquartered are in Westlake, Ohio. The Firm has operations and care offices in nearly 35 countries.