SEMICON Taiwan 2025 to Launch 3DIC AI Chip Packaging Alliance Amid Global Tech Shift

SEMICON Taiwan 2025 to Introduce AI Chip Packaging Alliance

As demand for AI and HPC fast-tracks, the semiconductor business is accepting a new age. With Moore’s Law reducing and grading challenges increasing, technologies such as chiplets, 3DIC, co-packaged optics (CPO), and panel-level fan-out (FOPLP) are becoming important for next-level recital and system incorporation. SEMICON Taiwan 2025 will limelight these developments through worldwide opportunities starting September 8, ahead of the key exhibition from September 10–12 at Taipei Nangang Exhibition Center. As worldwide supply chains are rearrangement and geopolitical pressures grow, Asia is hastening advanced packaging invention, with Taiwan developing as a planned hub.

To initiative worldwide partnership and next-gen arrangement incorporation, SEMI will formally launch the extremely predicted 3DIC Advanced Manufacturing Alliance (3DICAMA) at SEMICON Taiwan 2025. The association marks a main change from single-chip to system-level resolutions, targeting to increase cross-industry association, improve supply chain flexibility, promote standards adoption, and speed up technology commercialization, laying the groundwork for a highly integrated and efficient packaging ecosystem. SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million experts globally across the electronics and semiconductor enterprise and engineering supply chain.

We hasten member association on resolutions to top industry trials through Sustainability, Advocacy, Supply Chain Management, Workforce Development and other programs. Our SEMICON® descriptions and events, technology communities, standards, technology communities, and market intelligence support develop our members’ corporate development and inventions in design, services, devices, equipment, resources, and enabling smarter, software, faster, more safe electronics.

• This year’s Heterogeneous Integration Area will enlarge to 3 pavilions: Semiconductor Packaging, 3DIC Advanced Packaging, and FOPLP, containing cutting-edge machineries, tech demonstrations, business values, and supply chain association.
• Leading firms such as Coherent, Innolux, PTI, Comet, E&R Engineering, Lam Research, GP, Manz, Mirle, PSK, Shibaura, PDF Solutions, and Utechzone will display state-of-the-art system-level resolutions and incorporation requests, providing attendees main visions and partnership chances.

Global Chief Marketing Officer and President of Taiwan, SEMI, Terry Tsao, expressed,

“As AI demands surpass the limits of single-chip scaling, advanced packaging technologies like 3DIC and FOPLP are essential for system-level integration. With the industry moving from a linear supply chain to a more integrated and collaborative ecosystem, SEMICON Taiwan 2025 will serve as a vital global platform for industry leaders to explore how packaging and manufacturing innovation can unlock new commercial value across the semiconductor landscape.”