Smartkem and Manz Asia Partner to Develop Next-Gen AI Chip Packaging Solutions

Smartkem Enters a JDA with Manz Asia

Smartkem, a leading semiconductor material developer and supplier, announced to enter a preliminary joint development agreement (JDA) with Manz Asia to focus on co-developing next-generation dielectric ink solutions, which can be used for advanced packaging manufacturing.

Ian Jenks, the CEO and chairman of Smartkem, said,

"This joint development agreement builds on our collaboration with Manz Asia, which has already resulted in our first demonstration at SEMICON® SEA 2025 of an advanced inkjet metalization process for packaging chips for production. Together, we intend to develop scalable, high-performance solutions that address the critical bottlenecks, particularly in advanced computer and AI chip packaging. By combining Smartkem's unique semiconductor materials with Manz's precision inkjet technology.”

He further said,” We expect to create new manufacturing paradigms that address the demand for 12" wafer-level packaging solutions as well as extend beyond wafer-based limitations to open the door to efficient, large-area panel packaging. If successful, our efforts will result in higher yield and lower cost per packaged chip, which we believe is critical for data centers deploying tens of thousands of AI accelerators."

The general manager of Manz Asia, Lin Robert, also believes that the combination of Smartkem’s expertise in material science and the engineering excellence of Manz Asia will help in improving the industrial adoption of dielectric ink technology.

Dielectric inks are crucial in back-end-of-line (BEOL) processes, mainly in top-level insulation that ensures advanced-level packaging. The formations by Smartkem are popular as they provide robust film integrity, chemical compatibility, and high-resolution patterning.

The 12” wafer-level packaging is offering a growth path for data center infrastructure due to the rising demand for AI computing. Both companies believe that the JDA will significantly help in scaling the next-generation AI hardware, which will help in reducing the cost and environmental impact.