3M Joins JOINT3 Consortium to Advance Next-Gen Semiconductor Packaging

3M Joins Consortium to Advance Next-Gen Semiconductor Packaging

3M is linked with the next-generation semiconductor packaging association JOINT3, which is an effort to bring together worldwide leaders in semiconductor resources, apparatus, and plan. JOINT3 is a co-formation assessment platform recognized by Japan-based Resonac Corp. It aims to accelerate the development of tools for panel-level organic interposers, thin coatings made from organic resources that connect various parts of an electronic device, supporting electrical signals and power between components.

In recent years, advancements in packaging processes, including the integration, packaging, and testing of semiconductor materials, have emerged as a major technology for next-generation semiconductors. These semiconductors are crucial for rapidly growing markets such as autonomous vehicles and generative AI.

Among these services, 2.xD packages, which include positioning numerous semiconductor chips in parallel and linking them through an interposer, are anticipated to see additional development in demand because of growing data communication volume and speed necessities. As semiconductor presentation progresses, interposers are becoming larger, encouraging a change from organic to silicon resources.

Conventionally, interposers are cut from globular wafers, but as their size increases, fewer can be formed per wafer. To counter this, a new engineering technique utilizing square panels instead of circular wafers is being developed to improve interposer production. Using a sample line for 515 x 510mm panel-level organic interposers, the association is working on projects specifically enhanced for these interposers.

3M is a worldwide leader in resources science and invention, is thrilled to partner with Resonac and other semiconductor business leaders over the JOINT3 co-creative assessment platform to develop panel-level organic interposers.

“As critical influencers of device presentation and structures invention, innovative packaging technologies such as panel-level organic interposers are important for constructing upcoming-generation AI and high-performance chips,” expressed Steven Vander Louw, 3M’s president of show and electronics invention platforms. “With growing demand for speed to resolution in unconventional semiconductor requests, contractors must work collectively to offer inclusive resolutions to threatening challenges on progressively shorter timelines. 3M is enthusiastic to subsidize our crucial technology platforms and resolutions, offering decades of resources, science proficiency to support shaping the future of unconventional packaging and influence progress in semiconductor engineering and roadmap development.”