10 October 2025
At the Aicomp Summit 2026, the modern technical expansions and discoveries in the area of software for the packaging sector will be available in lectures and technically demanding workshops. This data is related for both packaging manufacturers and digitalization partners.
After the huge success of the Aicomp Summit 2024 in Berlin, the gathering will take place in Vienna for the first time in 2026. From March 11-13, 2026, attentive parties will learn more about making digital in the packaging sector at the 25hours Hotel in Viennas Museum Quarter.
In 2021, the worldwide renowned IT company Aicomp declared the first Aicomp Summit. The gathering is geared towards authorities and officials from the IT industry, with a superior emphasis on the packaging industry, and provides a platform for exchange on new skills and ways to improve the efficiency of industrial procedures. Aicomps aim is to support shaping the future of the packaging market in a sustainable way through invention and constant optimization.
The 2026 event will emphasize the latest expansions in artificial intelligence and sustainable construction. Aicomp itself emphasizes on main topics in product configuration and how these optimizations are made conceivable in all areas of the industry. In totaling, entirely new technological methods, such as AI-helped production planning and cloud-based SaaS solutions for the management of data and corporate control, will be described and discussed in detail.
Aicomp emphasizes the constant growth of its partner system and consequently brings together several partner companies to current relevant resolutions at the summit. Among the partners shown are well-known firms such as ORTEC, SAP, OMP, and T.CON.
These associates will show their recent technologies and resolutions to fulfill the precise needs of the packaging sector. SAP will show methods on how current systems can be progressively advanced for constructing a smarter company, specifically in the context of modern construction planning. OMP emphasizes improving the supply chain along the whole value chain from construction development to engineering. ORTEC will show advanced solutions for effective transport and route scheduling. T.CON emphasizes the growth of untapped construction potential and displays how modern SAP technologies can be united into prevailing system landscapes in an embattled manner.
10 October 2025
10 October 2025
10 October 2025
10 October 2025