As photonics systems continue to evolve, chip-package co-design has a significant role in the complete system architecture. By including packaging consequences directly into the planned workflow. Packaging trials have always been a crucial part of the silicon photonics system pattern, but packaging needs have not always been developed directly into the pattern workflow. As an alternative, designers often depend on standards and discussions with packaging teams to safeguard compatibility with presented developments. Though this cooperative approach may need supplementary repetition as plans are refined to fulfil those necessities.
To support bringing packaging factors more directly into the design surroundings, AIM Photonics has created its first Assembly Design Kit (ADK). Like how a Process Design Kit (PDK) allows designers to generate devices compatible with a semiconductor foundry’s manufacturing procedure, an ADK offers tools and verified elements that help safeguard photonic integrated circuit (PIC) patterns supporting obtainable packaging and assembly procedures.
“By bringing packaging deliberations straight into the design atmosphere, the ADK is anticipated to support reducing the requirement for late-stage design variations essential to make PIC designs compatible with AIM Photonics’ gathering and packaging procedures,” expressed Amit Dikshit, AIM Photonics Design Enablement Manager. “Designers can assess packaging needs earlier in the advanced process utilizing standardized packaging patterns and automated design instruments, supporting reduced design rehearsals and the probability of package re-spins.”
The primary ADK release gives a library of demonstrated elements and design models that facilitate engineers to align their photonic combined circuit arrangements with AIM Photonics packaging procedures. The release wires wideband and fibre-attach packaging arrangements, with patterns and verified proposal information that can be integrated directly into PIC layouts. Extra features comprise 3D models, PCB design archives and determined information to support designers in evaluating packaging concerns through growth.
The ADK is now supported in the KLayout, GDSFactory, Luceda and Cadence design environments and utilizes parametric cells (P Cells) to support confirming designs remain consistent with packaging necessities.
AIM Photonics ADK also facilitates multi-physics imitation comprising thermal, RF and optical analysis utilizing verified procedure parameters, permitting designers to measure packaging deliberations as part of the wider system proposal workflow.
16 June 2026
16 June 2026
16 June 2026
16 June 2026