ASML Ships First-Ever TWINSCAN XT:260 Lithography Machine for Advanced Semiconductor Packaging

ASML Ships First-Ever TWINSCAN XT:260 Lithography Machine

At the time of its quarterly results presentation, ASML confirmed that it has supplied its first TWINSCAN XT:260. It’s a lithography machine, designed specially for advanced packaging applications. This supply synchronizes with the declaration of its third-quarter 2025 results. With this result, the company achieved new technological milestones also reached financial success.

The XT:260 is planned for implementation in 3D integration processes, such as the production of interposers that position numerous chiplets. The scanner on the product uses i-line lithography with a solution and wavelength of approximately 365 nanometers, with an estimated range of 400 nanometers. The production speed is up to 270 wafers per hour, which is said to be 4 times greater than the previous packaging solutions. With this advancement, ASML focuses on bridging the gap between the back-end processes and front-end lithography that package and link chips.

The CEO of ASML, Christophe Fouquet, explained that advanced packaging has become an essential part of the semiconductor chain. He believes that the technologies established by ASML in its current scanners can be applied to the next generation of systems. The company has not yet revealed which customer got the first system.

This lithography machine was already brought to light in the earlier announcement. The head of the DUV division, Herman Boom, at ASML’s investor day held in November 2024, said, “The machine will be shipped in 2025. The system mitigates the pattern on the masks twice instead of four times, allowing the scanning of an exposure field of 26 by 33 millimeters. This huge area makes the system ideal for packaging applications under which the vast ground is often revealed.”

The development and this ASML scanner packaging-tech innovation is a massive strategy. Under this smart strategy lies ASML’s expansion of the role for the back end of semiconductor production. At the same time, the company is discovering new pathways to make deliveries more sustainable. The XT:260 is a system that can be delivered by ship, lowering expenses. This scanner invention is not just a relief to the technological sector but also beneficial for logistics. This is a multi-purpose step forward by ASML in the advanced packaging market. ASML’s initiative for advanced packaging with the XT:260 advancement has led to a milestone for the company, introducing a new approach to the advanced packaging sector.