Tageos and Pragmatic Semiconductor have extended their collaboration to introduce FlexIC-based RFID goods lines for NFC-allowed packaging and tags. The Tageos EOS Lite and EOS Zero Lite families utilize Pragmatic’s NFC Connect PR1301 chip, with the EOS-932 Zero Lite PR1301 presented as the first paper-based NFC inlay in the variety. For eeNews Europe bookworms, the introduction points to how NFC and RFID are shifting beyond traditional labels into lesser-carbon, high-volume packaging utilisation. It also represents how flexible semiconductor expertise may support decreased resource utilisation and help item-level connectivity at scale.
The EOS-932 Zero Lite PR1301 is planned for incorporation into paper labels and packaging, with usages comprising consumer conflict, product validation and brand safeguard. By linking a paper-based antenna with Pragmatic’s ultra-thin FlexIC, the inlay is projected to help NFC functionality without notably shifting the look or feel of the wrapping.
Tageos expressed that the product was grown at its Innovation Center of Excellence and is the initial in its portfolio to highlight Pragmatic’s NFC Connect PR1301 chip. The chip’s flexible structure consideration makes it appropriate for curved surfaces, packing and product-level incorporation, areas where traditional NFC or RFID structures can face constraints around recyclability, expense, and thickness.
The brands say the EOS Zero Lite and EOS Lite product families are focused on decreasing resources, carbon footprint and charges. For retail, customer products and logistics utility cases, that could make NFC-based product identity more feasible for mass-market implementation.
The broader market prospect lies in connecting physical goods to digital facilities. NFC inlays can permit customers to relate with packaging utilising a smartphone, while also giving products a route to verification, traceability and consumer engagement.
“Our close partnership with Pragmatic Semiconductor associates’ invention with a clear idea for sustainability, allowing consumers to offer extremely scalable, cost-effective, and truthfully sustainable NFC pieces for intelligent packaging usages,” expressed Matthieu Picon, CEO, Tageos. “The new and increasing FlexIC-based product coatings EOS Zero Lite and EOS Lite are yet another example of our path to accomplishment, opening new options for companies to link to their consumers through their goods and the customer’s most personal expedient, the smartphone.”
16 June 2026
16 June 2026
16 June 2026
16 June 2026