Packaging Innovation Takes Center Stage at SEMICON Taiwan 2025

Packaging Advancement at SEMICON Taiwan 2025

Announcement

SEMICON Taiwan on its 30th anniversary in 2025 with a huge gala event with the theme, leading with collaboration. Innovating with the world. It was organized at the Taipei Nangang Exhibition Center. The event continuously experienced wonders from September 10-12 straight featuring around 25 international forums focusing on sustainability and innovation. At the exhibition floor few significant technologies on display from company giants are targeted at advanced packaging, following the rising demand for high-performance chips for artificial intelligence applications.

Highlights of the SEMICON Taiwan 2025

OMRON introduced its current innovation in semiconductor manufacturing equipment, showing the companys commitment to yield advancement, contributing to the technologies and quality that fuel the future of AI. The major spotlight at OMRON is its partnership with the Mizuno Laboratory at National Cheng Kung University, run by Professor Jun Mizuno, a leading player in semiconductor packaging and materials. The collaboration discovers heterogeneous merger and advanced packaging with a target of precision 3D X-ray inspection to advance future process quality. Mizuno, associated with the Japan Institute of Electronics Packaging, alongside addressed the transformational capabilities of OMRONs safe inspection technologies.

Brand communications department, under Omrons global corporate communications and engagement HQ, Naiyuan Yeh confirmed that the company launched its semiconductor and incubation center this year, a new space dedicated to leveraging market growth and technology development in semiconductors. He also emphasized Omrons robust digital twin visualization technology, merging NVIDIA Omniverse with its Sysmac Studio platform. This provides a real-time mimic of x-ray system operations and inspection examined results, advancing process visibility and serving a smarter and quality management.

Another highlight of the event was PBA Systems chip packaging and metrology solutions. PBA Systems revealed its innovations to meet technological needs. The new metrology stage series and nano-precision dual gantry platform series are introduced to help advanced packaging processes such as smart manufacturing and CoWoS (chip-on-wafer-on-substrate). These platforms identify the crucial requirements that emerged from heterogeneous integration, engaging different materials, process demands, and bump densities as the company shifts from 2.5D to 3D architectures.

The product marketing manager at PBA Systems, Rose Yuan, stated that the companys dual-gantry nano precision platforms are designed for thermos-compression bonding, hybrid bonding, and accuracy flip-chip bonding. The dual gantry makes space for multi-axis motion, synchronization, and provides high-speed die bonding and accurate assembly within a small space, optimizing yield and space. The industry provides a rapid customization option to meet client needs. Additionally, the EV group EVG also unveiled EVG40 D2W, the companys first-ever empowered die-to-wafer (D2W) overlay metrology platform.