Innovation
On December 11, 2025, Samsung officially unveiled its Heat Path Block Technology, which is featured in the Exynos 2600, to sell this chip packaging solution to Qualcomm and Apple for their future mobile chips.
Samsung has designed a novel packaging method, Heat Pass Block (HPB), that includes a passive copper radiator within a chipset, which will not only save Samsung’s own thermals but will be potentially licensed to competitors and potential customers like Qualcomm and Apple, to bring Snapdragon heat under control in the future.
South Korean company, Samsung Electronics, is planning to provide the internally developed Exynos HPB packaging technology to its other potential customers, Apple and Qualcomm.
About Exynos 2600 featured Heat Path Blocks (HPB):
Exynos 2600 is a package that uses the novel heat path block technology. According to Samsung Foundry’s relevance, the new technology is helping to keep the 2nm Exynos cool even with intense processing.
Heat path blocks are designed to resolve overheating issues on advanced chips. The new technology exclusively featured in Exynos 2600 has opened up and is able to be used by Apple and Qualcomm. This is a strikingly bold move by Samsung. Instead of being reliable only on the phone’s vapor chamber and graphic layers to wick heat away, HPB is developed to reduce thermal resistance all the way at the source by increasing the path from die via package down to the handset’s cooling stack.
Exynos 2600 runs around 30% cooler compared to Exynos 2500, due to Heat Path Blocks (HPB). This novel packaging technology will replace the legacy method by using a copper-based heat spreader placed on top of the mobile AP to increase heat dissipation.
Samsung MX has reportedly been asking Qualcomm to provide its Snapdragon with HPB-level thermal dissipation packaging to make the processor stay cool during the process, with Exynos 2600 featuring a cutting-edge cooling technology.
Samsung’s Statements on the New Thermal Packaging Technology:
According to Samsung’s source, the demand for this new technology has already increased in the South Korean market, with Samsung’s MX Business, the final consumer for mobile apps, even requesting HPB-level thermal dissipation packaging from Qualcomm.
Hardware packaging industries are pleased with HPB’s key driving role behind the success of Exynos 2600. Samsung has minimized overheating by using the Heat Path Block. According to industry insiders, Exynos 2600 is well set to power Galaxy S26 and Plus in 2026.
Samsung Electronics is now positioning a proprietary thermal management technology for even external customers, as the company is seeking to reclaim foundry market share from TSMC.
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